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Abrasive Particles CMP Process Ceria Particles Contact Angle Electrokinetic Behavior Film Thickness Variation Higher Removal Rate NAND Flash Memory Nano Fumed Silica Particle Nitride Film Oxide Film PAA Chain PAA Concentration PAA Layer PAA Solution PVP PVP Polymer Pattern Density Polishing Rate Poly Si Poly Si Film Pram Removal Depth Removal Rate pH Iep thema EDItEUR::P Mathematics and Science thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TD Industrial chemistry and manufacturing technologies::TDC Industrial chemistry and chemical engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering