Latest Advancements in Semiconductor Materials, Devices, and Systems

The reprint Latest Advancements in Semiconductor Materials, Devices, and Systems compiles groundbreaking research from a Special Issue of Micromachines. This collection explores the forefront of semiconductor innovation, covering diverse topics such as material synthesis, advanced device architectur...

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collection Directory of Open Access Books
description The reprint Latest Advancements in Semiconductor Materials, Devices, and Systems compiles groundbreaking research from a Special Issue of Micromachines. This collection explores the forefront of semiconductor innovation, covering diverse topics such as material synthesis, advanced device architectures, numerical modeling, and emerging applications in electronics and optoelectronics. Aimed at researchers and industry professionals, this volume offers an in-depth perspective on the state-of-the-art developments shaping the future of semiconductor technology.
format Online
id doab-20.500.12854ir-153078
institution Directory of Open Access Books
language eng
publishDate 2025
publishDateRange 2025
publishDateSort 2025
publisher MDPI - Multidisciplinary Digital Publishing Institute
publisherStr MDPI - Multidisciplinary Digital Publishing Institute
record_format ojs
spelling doab-20.500.12854ir-1530782025-02-20T13:31:33Z Latest Advancements in Semiconductor Materials, Devices, and Systems Wang, Zeheng Huang, Jing-Kai GaN HEMT figure of merit coherent channel wide bandgap devices ultrawide bandgap devices silicon silicon carbide diamond power semiconductor devices GaN HEMT trap characterization methods DLTS AlGaN/GaN high electron mobility transistors (HEMTs) SiNx passivation low-pressure chemical vapor deposition (LPCVD) ohmic contact SiNx/GaN interface gate-all-around (GAA) Nanosheet FETs (NSFETs) compact model artificial neural network (ANN) TCAD simulation stacked DRAM WoW cross-process analysis methodology signal integrity integrated circuit (IC) models of integrated circuits for RF immunity behavioral simulation-conducted immunity modeling (ICIM-CI) immunity modeling electromagnetic compatibility (EMC) modeling direct power injection (DPI) X-parameters bandgap reference wide input range high-order curvature compensation temperature coefficient power amplifiers high efficiency 2.45 GHz TiO2 nanorod (NR) Al2O3 ultraviolet (UV) photodetector atomic layer deposition (ALD) n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::M Medicine and Nursing::MJ Clinical and internal medicine::MJC Diseases and disorders::MJCL Oncology The reprint Latest Advancements in Semiconductor Materials, Devices, and Systems compiles groundbreaking research from a Special Issue of Micromachines. This collection explores the forefront of semiconductor innovation, covering diverse topics such as material synthesis, advanced device architectures, numerical modeling, and emerging applications in electronics and optoelectronics. Aimed at researchers and industry professionals, this volume offers an in-depth perspective on the state-of-the-art developments shaping the future of semiconductor technology. 2025-02-20T13:31:30Z 2025-02-20T13:31:30Z 2024 book ONIX_20250220_9783725828081_442 9783725828081 9783725828074 https://directory.doabooks.org/handle/20.500.12854/153078 eng application/octet-stream Attribution 4.0 International https://mdpi.com/books/pdfview/book/10280 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-7258-2807-4 10.3390/books978-3-7258-2807-4 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783725828081 9783725828074 200 Basel open access
spellingShingle GaN
HEMT
figure of merit
coherent channel
wide bandgap devices
ultrawide bandgap devices
silicon
silicon carbide
diamond
power semiconductor devices
GaN HEMT
trap
characterization methods
DLTS
AlGaN/GaN
high electron mobility transistors (HEMTs)
SiNx passivation
low-pressure chemical vapor deposition (LPCVD)
ohmic contact
SiNx/GaN interface
gate-all-around (GAA) Nanosheet FETs (NSFETs)
compact model
artificial neural network (ANN)
TCAD simulation
stacked DRAM
WoW
cross-process analysis methodology
signal integrity
integrated circuit (IC)
models of integrated circuits for RF immunity behavioral simulation-conducted immunity modeling (ICIM-CI)
immunity modeling
electromagnetic compatibility (EMC) modeling
direct power injection (DPI)
X-parameters
bandgap reference
wide input range
high-order curvature compensation
temperature coefficient
power amplifiers
high efficiency
2.45 GHz
TiO2 nanorod (NR)
Al2O3
ultraviolet (UV) photodetector
atomic layer deposition (ALD)
n/a
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
thema EDItEUR::M Medicine and Nursing::MJ Clinical and internal medicine::MJC Diseases and disorders::MJCL Oncology
Latest Advancements in Semiconductor Materials, Devices, and Systems
title Latest Advancements in Semiconductor Materials, Devices, and Systems
title_full Latest Advancements in Semiconductor Materials, Devices, and Systems
title_fullStr Latest Advancements in Semiconductor Materials, Devices, and Systems
title_full_unstemmed Latest Advancements in Semiconductor Materials, Devices, and Systems
title_short Latest Advancements in Semiconductor Materials, Devices, and Systems
title_sort latest advancements in semiconductor materials devices and systems
topic GaN
HEMT
figure of merit
coherent channel
wide bandgap devices
ultrawide bandgap devices
silicon
silicon carbide
diamond
power semiconductor devices
GaN HEMT
trap
characterization methods
DLTS
AlGaN/GaN
high electron mobility transistors (HEMTs)
SiNx passivation
low-pressure chemical vapor deposition (LPCVD)
ohmic contact
SiNx/GaN interface
gate-all-around (GAA) Nanosheet FETs (NSFETs)
compact model
artificial neural network (ANN)
TCAD simulation
stacked DRAM
WoW
cross-process analysis methodology
signal integrity
integrated circuit (IC)
models of integrated circuits for RF immunity behavioral simulation-conducted immunity modeling (ICIM-CI)
immunity modeling
electromagnetic compatibility (EMC) modeling
direct power injection (DPI)
X-parameters
bandgap reference
wide input range
high-order curvature compensation
temperature coefficient
power amplifiers
high efficiency
2.45 GHz
TiO2 nanorod (NR)
Al2O3
ultraviolet (UV) photodetector
atomic layer deposition (ALD)
n/a
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
thema EDItEUR::M Medicine and Nursing::MJ Clinical and internal medicine::MJC Diseases and disorders::MJCL Oncology
topic_facet GaN
HEMT
figure of merit
coherent channel
wide bandgap devices
ultrawide bandgap devices
silicon
silicon carbide
diamond
power semiconductor devices
GaN HEMT
trap
characterization methods
DLTS
AlGaN/GaN
high electron mobility transistors (HEMTs)
SiNx passivation
low-pressure chemical vapor deposition (LPCVD)
ohmic contact
SiNx/GaN interface
gate-all-around (GAA) Nanosheet FETs (NSFETs)
compact model
artificial neural network (ANN)
TCAD simulation
stacked DRAM
WoW
cross-process analysis methodology
signal integrity
integrated circuit (IC)
models of integrated circuits for RF immunity behavioral simulation-conducted immunity modeling (ICIM-CI)
immunity modeling
electromagnetic compatibility (EMC) modeling
direct power injection (DPI)
X-parameters
bandgap reference
wide input range
high-order curvature compensation
temperature coefficient
power amplifiers
high efficiency
2.45 GHz
TiO2 nanorod (NR)
Al2O3
ultraviolet (UV) photodetector
atomic layer deposition (ALD)
n/a
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
thema EDItEUR::M Medicine and Nursing::MJ Clinical and internal medicine::MJC Diseases and disorders::MJCL Oncology
url ONIX_20250220_9783725828081_442