Development of CMOS-MEMS/NEMS Devices
Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and...
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| 主要な著者: | , |
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| フォーマット: | Online |
| 言語: | 英語 |
| 出版事項: |
MDPI - Multidisciplinary Digital Publishing Institute
2021
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| 主題: | |
| オンライン･アクセス: | 33717 |
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| _version_ | 1869527040978321408 |
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| author | Verd, Jaume Segura, Jaume |
| author_browse | Segura, Jaume Verd, Jaume |
| author_facet | Verd, Jaume Segura, Jaume |
| author_sort | Verd, Jaume |
| collection | Directory of Open Access Books |
| description | Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).] |
| format | Online |
| id | doab-20.500.12854ir-44945 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2021 |
| publishDateRange | 2021 |
| publishDateSort | 2021 |
| publisher | MDPI - Multidisciplinary Digital Publishing Institute |
| publisherStr | MDPI - Multidisciplinary Digital Publishing Institute |
| record_format | ojs |
| spelling | doab-20.500.12854ir-449452024-04-11T15:10:30Z Development of CMOS-MEMS/NEMS Devices Verd, Jaume Segura, Jaume TA1-2040 T1-995 encapsulation n/a NEM memory switch magnetotransistor gas sensor nano-system array metal oxide (MOX) sensor capacitive pressure sensor real-time temperature compensation loop mechanical relays single-crystal silicon (SC-Si) MEMS relays MEMS oscillator micro-electro-mechanical system (MEMS) uncooled IR-bolometer microelectromechanical systems microbolometer programmable sustaining amplifier micro sensor CMOS-MEMS pierce oscillator MEMS resonators micro/nanoelectromechanical systems (MEMS/NEMS) resonator microhotplate NEMS application-specific integrated circuit (ASIC) MEMS modelling magnetic field chopper instrumentation amplifier microresonators interface circuit Hall effect thermal detector temperature sensor infrared sensor CMOS–NEMS CMOS atomic force microscope MEMS switches stent micro-electro-mechanical systems (MEMS) sensors nano resonator silicon-on-insulator (SOI) MEMS-ASIC integration Sigma-Delta MEMS characterization high-Q capacitive accelerometer mass sensors M3D thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).] 2021-02-11T11:18:21Z 2021-02-11T11:18:21Z 2019-06-26 08:44:07 2019 book 33717 9783039210695 9783039210688 https://directory.doabooks.org/handle/20.500.12854/44945 eng image/jpeg Attribution-NonCommercial-NoDerivatives 4.0 International https://mdpi.com/books/pdfview/book/1387 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-03921-069-5 10.3390/books978-3-03921-069-5 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783039210695 9783039210688 165 open access |
| spellingShingle | TA1-2040 T1-995 encapsulation n/a NEM memory switch magnetotransistor gas sensor nano-system array metal oxide (MOX) sensor capacitive pressure sensor real-time temperature compensation loop mechanical relays single-crystal silicon (SC-Si) MEMS relays MEMS oscillator micro-electro-mechanical system (MEMS) uncooled IR-bolometer microelectromechanical systems microbolometer programmable sustaining amplifier micro sensor CMOS-MEMS pierce oscillator MEMS resonators micro/nanoelectromechanical systems (MEMS/NEMS) resonator microhotplate NEMS application-specific integrated circuit (ASIC) MEMS modelling magnetic field chopper instrumentation amplifier microresonators interface circuit Hall effect thermal detector temperature sensor infrared sensor CMOS–NEMS CMOS atomic force microscope MEMS switches stent micro-electro-mechanical systems (MEMS) sensors nano resonator silicon-on-insulator (SOI) MEMS-ASIC integration Sigma-Delta MEMS characterization high-Q capacitive accelerometer mass sensors M3D thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology Verd, Jaume Segura, Jaume Development of CMOS-MEMS/NEMS Devices |
| title | Development of CMOS-MEMS/NEMS Devices |
| title_full | Development of CMOS-MEMS/NEMS Devices |
| title_fullStr | Development of CMOS-MEMS/NEMS Devices |
| title_full_unstemmed | Development of CMOS-MEMS/NEMS Devices |
| title_short | Development of CMOS-MEMS/NEMS Devices |
| title_sort | development of cmos mems nems devices |
| topic | TA1-2040 T1-995 encapsulation n/a NEM memory switch magnetotransistor gas sensor nano-system array metal oxide (MOX) sensor capacitive pressure sensor real-time temperature compensation loop mechanical relays single-crystal silicon (SC-Si) MEMS relays MEMS oscillator micro-electro-mechanical system (MEMS) uncooled IR-bolometer microelectromechanical systems microbolometer programmable sustaining amplifier micro sensor CMOS-MEMS pierce oscillator MEMS resonators micro/nanoelectromechanical systems (MEMS/NEMS) resonator microhotplate NEMS application-specific integrated circuit (ASIC) MEMS modelling magnetic field chopper instrumentation amplifier microresonators interface circuit Hall effect thermal detector temperature sensor infrared sensor CMOS–NEMS CMOS atomic force microscope MEMS switches stent micro-electro-mechanical systems (MEMS) sensors nano resonator silicon-on-insulator (SOI) MEMS-ASIC integration Sigma-Delta MEMS characterization high-Q capacitive accelerometer mass sensors M3D thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| topic_facet | TA1-2040 T1-995 encapsulation n/a NEM memory switch magnetotransistor gas sensor nano-system array metal oxide (MOX) sensor capacitive pressure sensor real-time temperature compensation loop mechanical relays single-crystal silicon (SC-Si) MEMS relays MEMS oscillator micro-electro-mechanical system (MEMS) uncooled IR-bolometer microelectromechanical systems microbolometer programmable sustaining amplifier micro sensor CMOS-MEMS pierce oscillator MEMS resonators micro/nanoelectromechanical systems (MEMS/NEMS) resonator microhotplate NEMS application-specific integrated circuit (ASIC) MEMS modelling magnetic field chopper instrumentation amplifier microresonators interface circuit Hall effect thermal detector temperature sensor infrared sensor CMOS–NEMS CMOS atomic force microscope MEMS switches stent micro-electro-mechanical systems (MEMS) sensors nano resonator silicon-on-insulator (SOI) MEMS-ASIC integration Sigma-Delta MEMS characterization high-Q capacitive accelerometer mass sensors M3D thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| url | 33717 |
| work_keys_str_mv | AT verdjaume developmentofcmosmemsnemsdevices AT segurajaume developmentofcmosmemsnemsdevices |