High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...

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主要作者: Burger, Sofie
格式: Online
語言:英语
出版: KIT Scientific Publishing 2021
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author Burger, Sofie
author_browse Burger, Sofie
author_facet Burger, Sofie
author_sort Burger, Sofie
collection Directory of Open Access Books
description In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.
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institution Directory of Open Access Books
language eng
publishDate 2021
publishDateRange 2021
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publisher KIT Scientific Publishing
publisherStr KIT Scientific Publishing
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spelling doab-20.500.12854ir-492672024-04-09T23:16:38Z High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method Burger, Sofie T1-995 damage structure Fatigue thin film cantilever bending thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment. 2021-02-11T15:15:38Z 2021-02-11T15:15:38Z 2019-07-30 20:02:01 2013 book 35355 21929963 9783731500254 https://directory.doabooks.org/handle/20.500.12854/49267 eng Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie image/jpeg Attribution-NonCommercial-NoDerivatives 4.0 International https://www.ksp.kit.edu/9783731500254 KIT Scientific Publishing 10.5445/KSP/1000034759 10.5445/KSP/1000034759 68fffc18-8f7b-44fa-ac7e-0b7d7d979bd2 9783731500254 XII, 140 p. open access
spellingShingle T1-995
damage structure
Fatigue
thin film
cantilever bending
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
Burger, Sofie
High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_full High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_fullStr High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_full_unstemmed High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_short High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
title_sort high cycle fatigue of al and cu thin films by a novel high throughput method
topic T1-995
damage structure
Fatigue
thin film
cantilever bending
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
topic_facet T1-995
damage structure
Fatigue
thin film
cantilever bending
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
url 35355
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