Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance...

Disgrifiad llawn

Wedi'i Gadw mewn:
Manylion Llyfryddiaeth
Prif Awdur: Mishra, Nilesha
Fformat: Online
Iaith:Saesneg
Cyhoeddwyd: KIT Scientific Publishing 2021
Pynciau:
Mynediad Ar-lein:35069
Tagiau: Ychwanegu Tag
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
_version_ 1869526256493527040
author Mishra, Nilesha
author_browse Mishra, Nilesha
author_facet Mishra, Nilesha
author_sort Mishra, Nilesha
collection Directory of Open Access Books
description Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.
format Online
id doab-20.500.12854ir-50197
institution Directory of Open Access Books
language eng
publishDate 2021
publishDateRange 2021
publishDateSort 2021
publisher KIT Scientific Publishing
publisherStr KIT Scientific Publishing
record_format ojs
spelling doab-20.500.12854ir-501972024-04-09T23:15:33Z Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates Mishra, Nilesha T1-995 elektromechanische Charakterisierung flexible Elektronik thin-film devices Ink-jet printing flexible electronics synchrotron X-ray diffraction Dünnschichtbauteil Ink-jet drucken Synchrotron-Röntgenbeugung electro-mechanical characterization thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations. 2021-02-11T16:11:05Z 2021-02-11T16:11:05Z 2019-07-30 20:02:00 2019 book 35069 21929963 9783731508533 https://directory.doabooks.org/handle/20.500.12854/50197 eng Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie image/jpeg Attribution-ShareAlike 4.0 International https://www.ksp.kit.edu/9783731508533 KIT Scientific Publishing 10.5445/KSP/1000086125 10.5445/KSP/1000086125 68fffc18-8f7b-44fa-ac7e-0b7d7d979bd2 9783731508533 X, 127 p. open access
spellingShingle T1-995
elektromechanische Charakterisierung
flexible Elektronik
thin-film devices
Ink-jet printing
flexible electronics
synchrotron X-ray diffraction
Dünnschichtbauteil
Ink-jet drucken
Synchrotron-Röntgenbeugung
electro-mechanical characterization
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
Mishra, Nilesha
Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
title Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
title_full Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
title_fullStr Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
title_full_unstemmed Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
title_short Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
title_sort influence of strain on the functionality of ink jet printed thin films and devices on flexible substrates
topic T1-995
elektromechanische Charakterisierung
flexible Elektronik
thin-film devices
Ink-jet printing
flexible electronics
synchrotron X-ray diffraction
Dünnschichtbauteil
Ink-jet drucken
Synchrotron-Röntgenbeugung
electro-mechanical characterization
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
topic_facet T1-995
elektromechanische Charakterisierung
flexible Elektronik
thin-film devices
Ink-jet printing
flexible electronics
synchrotron X-ray diffraction
Dünnschichtbauteil
Ink-jet drucken
Synchrotron-Röntgenbeugung
electro-mechanical characterization
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
url 35069
work_keys_str_mv AT mishranilesha influenceofstrainonthefunctionalityofinkjetprintedthinfilmsanddevicesonflexiblesubstrates