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Microstructure and Mechanical Properties of Structural Metals and Alloys

The papers collected in this special issue clearly reflect the modern research trends in materials science. These fields of specific attention are high-Mn TWIP steels, high-Cr heat resistant steels, aluminum alloys, ultrafine grained materials including those developed by severe plastic deformation,...

Täydet tiedot

Tallennettuna:
Päätekijä: Belyakov, Andrey
Aineistotyyppi: Online
Kieli:englanti
Julkaistu: MDPI - Multidisciplinary Digital Publishing Institute 2021
Aiheet:
T1-995
TP155-156
n/a
microstructure
high-pressure torsion
electron backscattered diffraction
grain boundary engineering
strengthening mechanism
precipitation
recrystallization
bimodal ferrite steel
transmission electron microscopy (TEM)
hot compression
metal–matrix composite
columnar grain
shape memory alloy
hardness
structural steel plate
dynamic recovery
nonmetallic inclusions
SEM
Cu-Al-Mn
ferritic steel
strain rate
strengthening
elastocaloric effect
Mg–Sm–Zn–Zr
dynamic recrystallization
growth rate
corrosion resistance
lead-free solder
high-Mn TWIP steel
Sn-8.0Sb-3.0Ag
SDSS
measuring temperature
texture
martensitic steels
dynamic precipitation
nanoindentation
Al-Fe-Si-Zr system
low-temperature
orientation relationship
M23C6
PWHT
grain refinement
force peak
aging
cycle time
amorphization
Al metal matrix composites
aluminum alloys
in situ tensile testing
microstructure evolution
Cu-Cr-Zr
irradiation
EBSD
welded rotor
?-phase
high-entropy alloys
creep
martensitic expansion
super duplex stainless steel
mechanical properties
high-Mn steel
ion irradiation
austenitic 304 stainless steels
impact toughness
cold rolling
ultrafine-grained microstructure
press hardening
mechanical property
recovery
annealing
deformation twinning
post-weld heat treatment
rare earth control
abnormal grain growth
electron microscopy
sub-merged arc welding
M6C
RAFM steels
microstructure analysis
electrical resistivity
twinning
Sb solder
work hardening
microhardness
hot stamping
weld metal
electrical conductivity
solder microstructure
annealing twins
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
Linkit:33711
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