Thermal and Electro-thermal System Simulation
With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, t...
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| Главные авторы: | , |
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| Формат: | Online |
| Язык: | английский |
| Опубликовано: |
MDPI - Multidisciplinary Digital Publishing Institute
2021
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| Предметы: | |
| Online-ссылка: | 42641 |
| Метки: |
Нет меток, Требуется 1-ая метка записи!
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| _version_ | 1869525286299631616 |
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| author | Codecasa, Lorenzo Rencz, Márta |
| author_browse | Codecasa, Lorenzo Rencz, Márta |
| author_facet | Codecasa, Lorenzo Rencz, Márta |
| author_sort | Codecasa, Lorenzo |
| collection | Directory of Open Access Books |
| description | With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects. |
| format | Online |
| id | doab-20.500.12854ir-60867 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2021 |
| publishDateRange | 2021 |
| publishDateSort | 2021 |
| publisher | MDPI - Multidisciplinary Digital Publishing Institute |
| publisherStr | MDPI - Multidisciplinary Digital Publishing Institute |
| record_format | ojs |
| spelling | doab-20.500.12854ir-608672024-04-11T15:10:27Z Thermal and Electro-thermal System Simulation Codecasa, Lorenzo Rencz, Márta TA1-2040 T1-995 thermal interface material thermal aging modeling LED compact thermal models niobium pentoxide model-order reduction ferromagnetic cores LED digital twin Cauer RC ladder in-situ characterization electronic packages time domain thermoreflectance multi-domain compact model power LEDs DC–DC converters structure function boundary condition independent electric aircraft multi-LED modelling light emitting diodes thin film JEDEC metrics tool agnostic power losses switching dynamic thermal compact model thermal transient testing reliability thermal transient analysis thermal simulation non-destructive testing IGBT carbon nanotubes compact thermal model power semiconductor devices SPICE phosphor light conversion thermal management LED luminaire design design flow thermal characterization motor cooling thermal phenomena silicone dome LED secondary heat path multi-domain modelling heating and optical power transient analysis thermal testability thermal conductivity multiple heat source thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects. 2021-02-12T05:51:46Z 2021-02-12T05:51:46Z 2019-12-09 11:49:16 2019 book 42641 9783039217373 9783039217366 https://directory.doabooks.org/handle/20.500.12854/60867 eng application/octet-stream Attribution-NonCommercial-NoDerivatives 4.0 International https://mdpi.com/books/pdfview/book/1797 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-03921-737-3 10.3390/books978-3-03921-737-3 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783039217373 9783039217366 222 open access |
| spellingShingle | TA1-2040 T1-995 thermal interface material thermal aging modeling LED compact thermal models niobium pentoxide model-order reduction ferromagnetic cores LED digital twin Cauer RC ladder in-situ characterization electronic packages time domain thermoreflectance multi-domain compact model power LEDs DC–DC converters structure function boundary condition independent electric aircraft multi-LED modelling light emitting diodes thin film JEDEC metrics tool agnostic power losses switching dynamic thermal compact model thermal transient testing reliability thermal transient analysis thermal simulation non-destructive testing IGBT carbon nanotubes compact thermal model power semiconductor devices SPICE phosphor light conversion thermal management LED luminaire design design flow thermal characterization motor cooling thermal phenomena silicone dome LED secondary heat path multi-domain modelling heating and optical power transient analysis thermal testability thermal conductivity multiple heat source thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology Codecasa, Lorenzo Rencz, Márta Thermal and Electro-thermal System Simulation |
| title | Thermal and Electro-thermal System Simulation |
| title_full | Thermal and Electro-thermal System Simulation |
| title_fullStr | Thermal and Electro-thermal System Simulation |
| title_full_unstemmed | Thermal and Electro-thermal System Simulation |
| title_short | Thermal and Electro-thermal System Simulation |
| title_sort | thermal and electro thermal system simulation |
| topic | TA1-2040 T1-995 thermal interface material thermal aging modeling LED compact thermal models niobium pentoxide model-order reduction ferromagnetic cores LED digital twin Cauer RC ladder in-situ characterization electronic packages time domain thermoreflectance multi-domain compact model power LEDs DC–DC converters structure function boundary condition independent electric aircraft multi-LED modelling light emitting diodes thin film JEDEC metrics tool agnostic power losses switching dynamic thermal compact model thermal transient testing reliability thermal transient analysis thermal simulation non-destructive testing IGBT carbon nanotubes compact thermal model power semiconductor devices SPICE phosphor light conversion thermal management LED luminaire design design flow thermal characterization motor cooling thermal phenomena silicone dome LED secondary heat path multi-domain modelling heating and optical power transient analysis thermal testability thermal conductivity multiple heat source thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| topic_facet | TA1-2040 T1-995 thermal interface material thermal aging modeling LED compact thermal models niobium pentoxide model-order reduction ferromagnetic cores LED digital twin Cauer RC ladder in-situ characterization electronic packages time domain thermoreflectance multi-domain compact model power LEDs DC–DC converters structure function boundary condition independent electric aircraft multi-LED modelling light emitting diodes thin film JEDEC metrics tool agnostic power losses switching dynamic thermal compact model thermal transient testing reliability thermal transient analysis thermal simulation non-destructive testing IGBT carbon nanotubes compact thermal model power semiconductor devices SPICE phosphor light conversion thermal management LED luminaire design design flow thermal characterization motor cooling thermal phenomena silicone dome LED secondary heat path multi-domain modelling heating and optical power transient analysis thermal testability thermal conductivity multiple heat source thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| url | 42641 |
| work_keys_str_mv | AT codecasalorenzo thermalandelectrothermalsystemsimulation AT renczmarta thermalandelectrothermalsystemsimulation |