Electroplating of Nanostructures

The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be c...

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Format: Online
Language:English
Published: IntechOpen 2021
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Online Access:ONIX_20210420_9789535122135_2142
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collection Directory of Open Access Books
description The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology.
format Online
id doab-20.500.12854ir-66783
institution Directory of Open Access Books
language eng
publishDate 2021
publishDateRange 2021
publishDateSort 2021
publisher IntechOpen
publisherStr IntechOpen
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spelling doab-20.500.12854ir-667832024-04-05T12:33:09Z Electroplating of Nanostructures Aliofkhazraei, Mahmood Condensed matter physics (liquid state & solid state physics) thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics) The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology. 2021-04-20T15:53:16Z 2021-04-20T15:53:16Z 2015 book ONIX_20210420_9789535122135_2142 9789535122135 9789535157656 https://directory.doabooks.org/handle/20.500.12854/66783 eng image/jpeg n/a https://www.intechopen.com/books https://mts.intechopen.com/storage/books/4718/authors_book/authors_book.pdf IntechOpen IntechOpen 10.5772/59706 10.5772/59706 78a36484-2c0c-47cb-ad67-2b9f5cd4a8f6 9789535122135 9789535157656 IntechOpen 318 open access
spellingShingle Condensed matter physics (liquid state & solid state physics)
thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics)
Electroplating of Nanostructures
title Electroplating of Nanostructures
title_full Electroplating of Nanostructures
title_fullStr Electroplating of Nanostructures
title_full_unstemmed Electroplating of Nanostructures
title_short Electroplating of Nanostructures
title_sort electroplating of nanostructures
topic Condensed matter physics (liquid state & solid state physics)
thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics)
topic_facet Condensed matter physics (liquid state & solid state physics)
thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics)
url ONIX_20210420_9789535122135_2142