Electroplating of Nanostructures
The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be c...
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| Format: | Online |
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| Language: | English |
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IntechOpen
2021
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| Online Access: | ONIX_20210420_9789535122135_2142 |
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| _version_ | 1869530497433993216 |
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| collection | Directory of Open Access Books |
| description | The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology. |
| format | Online |
| id | doab-20.500.12854ir-66783 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2021 |
| publishDateRange | 2021 |
| publishDateSort | 2021 |
| publisher | IntechOpen |
| publisherStr | IntechOpen |
| record_format | ojs |
| spelling | doab-20.500.12854ir-667832024-04-05T12:33:09Z Electroplating of Nanostructures Aliofkhazraei, Mahmood Condensed matter physics (liquid state & solid state physics) thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics) The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology. 2021-04-20T15:53:16Z 2021-04-20T15:53:16Z 2015 book ONIX_20210420_9789535122135_2142 9789535122135 9789535157656 https://directory.doabooks.org/handle/20.500.12854/66783 eng image/jpeg n/a https://www.intechopen.com/books https://mts.intechopen.com/storage/books/4718/authors_book/authors_book.pdf IntechOpen IntechOpen 10.5772/59706 10.5772/59706 78a36484-2c0c-47cb-ad67-2b9f5cd4a8f6 9789535122135 9789535157656 IntechOpen 318 open access |
| spellingShingle | Condensed matter physics (liquid state & solid state physics) thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics) Electroplating of Nanostructures |
| title | Electroplating of Nanostructures |
| title_full | Electroplating of Nanostructures |
| title_fullStr | Electroplating of Nanostructures |
| title_full_unstemmed | Electroplating of Nanostructures |
| title_short | Electroplating of Nanostructures |
| title_sort | electroplating of nanostructures |
| topic | Condensed matter physics (liquid state & solid state physics) thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics) |
| topic_facet | Condensed matter physics (liquid state & solid state physics) thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics) |
| url | ONIX_20210420_9789535122135_2142 |