Electronics Cooling

Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based techn...

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Hōputu: Online
Reo:Ingarihi
I whakaputaina: IntechOpen 2021
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Urunga tuihono:ONIX_20210420_9789535124061_2190
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collection Directory of Open Access Books
description Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
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institution Directory of Open Access Books
language eng
publishDate 2021
publishDateRange 2021
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publisher IntechOpen
publisherStr IntechOpen
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spelling doab-20.500.12854ir-668312024-04-14T10:27:56Z Electronics Cooling M Sohel Murshed, S Computer networking & communications thema EDItEUR::U Computing and Information Technology::UT Computer networking and communications Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries. 2021-04-20T15:54:38Z 2021-04-20T15:54:38Z 2016 book ONIX_20210420_9789535124061_2190 9789535124061 9789535124054 9789535157809 https://directory.doabooks.org/handle/20.500.12854/66831 eng image/jpeg n/a https://www.intechopen.com/books https://mts.intechopen.com/storage/books/5150/authors_book/authors_book.pdf IntechOpen IntechOpen 10.5772/61407 10.5772/61407 78a36484-2c0c-47cb-ad67-2b9f5cd4a8f6 9789535124061 9789535124054 9789535157809 IntechOpen 182 open access
spellingShingle Computer networking & communications
thema EDItEUR::U Computing and Information Technology::UT Computer networking and communications
Electronics Cooling
title Electronics Cooling
title_full Electronics Cooling
title_fullStr Electronics Cooling
title_full_unstemmed Electronics Cooling
title_short Electronics Cooling
title_sort electronics cooling
topic Computer networking & communications
thema EDItEUR::U Computing and Information Technology::UT Computer networking and communications
topic_facet Computer networking & communications
thema EDItEUR::U Computing and Information Technology::UT Computer networking and communications
url ONIX_20210420_9789535124061_2190