Lead Free Solders
This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered...
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| 格式: | Online |
|---|---|
| 語言: | 英语 |
| 出版: |
IntechOpen
2021
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| 主題: | |
| 在線閱讀: | ONIX_20210420_9781789854602_2384 |
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| _version_ | 1869525887605538816 |
|---|---|
| collection | Directory of Open Access Books |
| description | This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia. |
| format | Online |
| id | doab-20.500.12854ir-67025 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2021 |
| publishDateRange | 2021 |
| publishDateSort | 2021 |
| publisher | IntechOpen |
| publisherStr | IntechOpen |
| record_format | ojs |
| spelling | doab-20.500.12854ir-670252024-04-11T15:10:57Z Lead Free Solders Kar, Abhijit Metals technology / metallurgy thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TD Industrial chemistry and manufacturing technologies::TDC Industrial chemistry and chemical engineering::TDCW Pharmaceutical chemistry and technology This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia. 2021-04-20T16:00:36Z 2021-04-20T16:00:36Z 2019 book ONIX_20210420_9781789854602_2384 9781789854602 9781789854596 9781839622786 https://directory.doabooks.org/handle/20.500.12854/67025 eng image/jpeg n/a https://www.intechopen.com/books https://mts.intechopen.com/storage/books/7563/authors_book/authors_book.pdf IntechOpen IntechOpen 10.5772/intechopen.76955 10.5772/intechopen.76955 78a36484-2c0c-47cb-ad67-2b9f5cd4a8f6 9781789854602 9781789854596 9781839622786 IntechOpen 94 open access |
| spellingShingle | Metals technology / metallurgy thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TD Industrial chemistry and manufacturing technologies::TDC Industrial chemistry and chemical engineering::TDCW Pharmaceutical chemistry and technology Lead Free Solders |
| title | Lead Free Solders |
| title_full | Lead Free Solders |
| title_fullStr | Lead Free Solders |
| title_full_unstemmed | Lead Free Solders |
| title_short | Lead Free Solders |
| title_sort | lead free solders |
| topic | Metals technology / metallurgy thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TD Industrial chemistry and manufacturing technologies::TDC Industrial chemistry and chemical engineering::TDCW Pharmaceutical chemistry and technology |
| topic_facet | Metals technology / metallurgy thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TD Industrial chemistry and manufacturing technologies::TDC Industrial chemistry and chemical engineering::TDCW Pharmaceutical chemistry and technology |
| url | ONIX_20210420_9781789854602_2384 |