Thermal and Electro-thermal System Simulation 2020

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These co...

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Aineistotyyppi: Online
Kieli:englanti
Julkaistu: MDPI - Multidisciplinary Digital Publishing Institute 2021
Aiheet:
ROM
BGA
VO2
CFD
LED
Linkit:ONIX_20210501_9783039438310_27
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_version_ 1869530359470751744
collection Directory of Open Access Books
description This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
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language eng
publishDate 2021
publishDateRange 2021
publishDateSort 2021
publisher MDPI - Multidisciplinary Digital Publishing Institute
publisherStr MDPI - Multidisciplinary Digital Publishing Institute
record_format ojs
spelling doab-20.500.12854ir-682842024-04-11T15:10:37Z Thermal and Electro-thermal System Simulation 2020 Rencz, Márta Codecasa, Lorenzo Poppe, Andras lithium-ion battery thermal modelling electro-thermal model heat generation experimental validation thermal transient testing non-destructive testing thermal testability accuracy repeatability and reproducibility of thermal measurements thermal testing standards 3D IC microchannels liquid cooling compact thermal model thermal simulation hotspot thermal-aware task scheduling DVFS statistical analysis electronic packages detailed thermal model Joint Electron Device Engineering Council (JEDEC) metrics thermal impedance AlGaN-GaN HEMT TDTR thermal conductivity thermal interface resistance size effect phonon transport mechanisms nonlinear thermal model SPICE pulse transformer thermal phenomena self-heating modelling measurements BCI-DCTM ROM modal approach BGA module temperature solar energy heat transfer mechanisms power LED measurement and simulation life testing reliability testing LM-80 TM-21 LED lifetime modelling LED multi-domain modelling Spice-like modelling of LEDs lifetime extrapolation and modelling of LEDs beyond CMOS VO2 thermal-electronic circuits electro-thermal simulation vertical structure power LEDs thermal pads thermal resistance optical efficiency electronics cooling Light-emitting diodes CoB LEDs multi-domain modeling finite volume method phosphor modeling magnetic nanoparticle microfluidics CFD OpenFOAM two-phase solver rheology LED Delphi4LED digital twin digital luminaire design computation time Industry 4.0 thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures. 2021-05-01T15:06:10Z 2021-05-01T15:06:10Z 2021 book ONIX_20210501_9783039438310_27 9783039438310 9783039438327 https://directory.doabooks.org/handle/20.500.12854/68284 eng application/octet-stream Attribution 4.0 International https://mdpi.com/books/pdfview/book/3293 https://mdpi.com/books/pdfview/book/3293 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-03943-832-7 10.3390/books978-3-03943-832-7 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783039438310 9783039438327 310 Basel, Switzerland open access
spellingShingle lithium-ion battery
thermal modelling
electro-thermal model
heat generation
experimental validation
thermal transient testing
non-destructive testing
thermal testability
accuracy repeatability and reproducibility of thermal measurements
thermal testing standards
3D IC
microchannels
liquid cooling
compact thermal model
thermal simulation
hotspot
thermal-aware task scheduling
DVFS
statistical analysis
electronic packages
detailed thermal model
Joint Electron Device Engineering Council (JEDEC) metrics
thermal impedance
AlGaN-GaN HEMT
TDTR
thermal conductivity
thermal interface resistance
size effect
phonon transport mechanisms
nonlinear thermal model
SPICE
pulse transformer
thermal phenomena
self-heating
modelling
measurements
BCI-DCTM
ROM
modal approach
BGA
module temperature
solar energy
heat transfer mechanisms
power LED measurement and simulation
life testing
reliability testing
LM-80
TM-21
LED lifetime modelling
LED multi-domain modelling
Spice-like modelling of LEDs
lifetime extrapolation and modelling of LEDs
beyond CMOS
VO2
thermal-electronic circuits
electro-thermal simulation
vertical structure
power LEDs
thermal pads
thermal resistance
optical efficiency
electronics cooling
Light-emitting diodes
CoB LEDs
multi-domain modeling
finite volume method
phosphor modeling
magnetic nanoparticle
microfluidics
CFD
OpenFOAM
two-phase solver
rheology
LED
Delphi4LED
digital twin
digital luminaire design
computation time
Industry 4.0
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology
Thermal and Electro-thermal System Simulation 2020
title Thermal and Electro-thermal System Simulation 2020
title_full Thermal and Electro-thermal System Simulation 2020
title_fullStr Thermal and Electro-thermal System Simulation 2020
title_full_unstemmed Thermal and Electro-thermal System Simulation 2020
title_short Thermal and Electro-thermal System Simulation 2020
title_sort thermal and electro thermal system simulation 2020
topic lithium-ion battery
thermal modelling
electro-thermal model
heat generation
experimental validation
thermal transient testing
non-destructive testing
thermal testability
accuracy repeatability and reproducibility of thermal measurements
thermal testing standards
3D IC
microchannels
liquid cooling
compact thermal model
thermal simulation
hotspot
thermal-aware task scheduling
DVFS
statistical analysis
electronic packages
detailed thermal model
Joint Electron Device Engineering Council (JEDEC) metrics
thermal impedance
AlGaN-GaN HEMT
TDTR
thermal conductivity
thermal interface resistance
size effect
phonon transport mechanisms
nonlinear thermal model
SPICE
pulse transformer
thermal phenomena
self-heating
modelling
measurements
BCI-DCTM
ROM
modal approach
BGA
module temperature
solar energy
heat transfer mechanisms
power LED measurement and simulation
life testing
reliability testing
LM-80
TM-21
LED lifetime modelling
LED multi-domain modelling
Spice-like modelling of LEDs
lifetime extrapolation and modelling of LEDs
beyond CMOS
VO2
thermal-electronic circuits
electro-thermal simulation
vertical structure
power LEDs
thermal pads
thermal resistance
optical efficiency
electronics cooling
Light-emitting diodes
CoB LEDs
multi-domain modeling
finite volume method
phosphor modeling
magnetic nanoparticle
microfluidics
CFD
OpenFOAM
two-phase solver
rheology
LED
Delphi4LED
digital twin
digital luminaire design
computation time
Industry 4.0
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology
topic_facet lithium-ion battery
thermal modelling
electro-thermal model
heat generation
experimental validation
thermal transient testing
non-destructive testing
thermal testability
accuracy repeatability and reproducibility of thermal measurements
thermal testing standards
3D IC
microchannels
liquid cooling
compact thermal model
thermal simulation
hotspot
thermal-aware task scheduling
DVFS
statistical analysis
electronic packages
detailed thermal model
Joint Electron Device Engineering Council (JEDEC) metrics
thermal impedance
AlGaN-GaN HEMT
TDTR
thermal conductivity
thermal interface resistance
size effect
phonon transport mechanisms
nonlinear thermal model
SPICE
pulse transformer
thermal phenomena
self-heating
modelling
measurements
BCI-DCTM
ROM
modal approach
BGA
module temperature
solar energy
heat transfer mechanisms
power LED measurement and simulation
life testing
reliability testing
LM-80
TM-21
LED lifetime modelling
LED multi-domain modelling
Spice-like modelling of LEDs
lifetime extrapolation and modelling of LEDs
beyond CMOS
VO2
thermal-electronic circuits
electro-thermal simulation
vertical structure
power LEDs
thermal pads
thermal resistance
optical efficiency
electronics cooling
Light-emitting diodes
CoB LEDs
multi-domain modeling
finite volume method
phosphor modeling
magnetic nanoparticle
microfluidics
CFD
OpenFOAM
two-phase solver
rheology
LED
Delphi4LED
digital twin
digital luminaire design
computation time
Industry 4.0
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology
url ONIX_20210501_9783039438310_27