Latest Advances in Electrothermal Models
This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulati...
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| Format: | Online |
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| Idioma: | anglès |
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MDPI - Multidisciplinary Digital Publishing Institute
2021
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| Accés en línia: | ONIX_20210501_9783036503349_236 |
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| _version_ | 1869527378488721408 |
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| collection | Directory of Open Access Books |
| description | This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale. |
| format | Online |
| id | doab-20.500.12854ir-68490 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2021 |
| publishDateRange | 2021 |
| publishDateSort | 2021 |
| publisher | MDPI - Multidisciplinary Digital Publishing Institute |
| publisherStr | MDPI - Multidisciplinary Digital Publishing Institute |
| record_format | ojs |
| spelling | doab-20.500.12854ir-684902024-04-11T15:10:31Z Latest Advances in Electrothermal Models Górecki, Krzysztof Górecki, Paweł Dual-Phase-Lag heat transfer model thermal simulation algorithm thermal measurements Finite Difference Method scheme Grünwald–Letnikov fractional derivative Krylov subspace-based model order reduction algorithm efficiency analysis relative error analysis algorithm convergence analysis computational complexity analysis finite difference method scheme BJT modelling self-heating silicon carbide SPICE IGBT DC–DC converter electrothermal model averaged model thermal phenomena diode–transistor switch power electronics multi-LED lighting modules device thermal coupling compact thermal models temperature sensors microprocessor throughput improvement inductors ferromagnetic cores thermal model transient thermal impedance thermal resistance electrothermal (ET) simulation finite-element method (FEM) model-order reduction (MOR) multicellular power MOSFET silicon carbide (SiC) thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale. 2021-05-01T15:11:16Z 2021-05-01T15:11:16Z 2021 book ONIX_20210501_9783036503349_236 9783036503349 9783036503356 https://directory.doabooks.org/handle/20.500.12854/68490 eng application/octet-stream Attribution 4.0 International https://mdpi.com/books/pdfview/book/3510 https://mdpi.com/books/pdfview/book/3510 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-0365-0335-6 10.3390/books978-3-0365-0335-6 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783036503349 9783036503356 140 Basel, Switzerland open access |
| spellingShingle | Dual-Phase-Lag heat transfer model thermal simulation algorithm thermal measurements Finite Difference Method scheme Grünwald–Letnikov fractional derivative Krylov subspace-based model order reduction algorithm efficiency analysis relative error analysis algorithm convergence analysis computational complexity analysis finite difference method scheme BJT modelling self-heating silicon carbide SPICE IGBT DC–DC converter electrothermal model averaged model thermal phenomena diode–transistor switch power electronics multi-LED lighting modules device thermal coupling compact thermal models temperature sensors microprocessor throughput improvement inductors ferromagnetic cores thermal model transient thermal impedance thermal resistance electrothermal (ET) simulation finite-element method (FEM) model-order reduction (MOR) multicellular power MOSFET silicon carbide (SiC) thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology Latest Advances in Electrothermal Models |
| title | Latest Advances in Electrothermal Models |
| title_full | Latest Advances in Electrothermal Models |
| title_fullStr | Latest Advances in Electrothermal Models |
| title_full_unstemmed | Latest Advances in Electrothermal Models |
| title_short | Latest Advances in Electrothermal Models |
| title_sort | latest advances in electrothermal models |
| topic | Dual-Phase-Lag heat transfer model thermal simulation algorithm thermal measurements Finite Difference Method scheme Grünwald–Letnikov fractional derivative Krylov subspace-based model order reduction algorithm efficiency analysis relative error analysis algorithm convergence analysis computational complexity analysis finite difference method scheme BJT modelling self-heating silicon carbide SPICE IGBT DC–DC converter electrothermal model averaged model thermal phenomena diode–transistor switch power electronics multi-LED lighting modules device thermal coupling compact thermal models temperature sensors microprocessor throughput improvement inductors ferromagnetic cores thermal model transient thermal impedance thermal resistance electrothermal (ET) simulation finite-element method (FEM) model-order reduction (MOR) multicellular power MOSFET silicon carbide (SiC) thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| topic_facet | Dual-Phase-Lag heat transfer model thermal simulation algorithm thermal measurements Finite Difference Method scheme Grünwald–Letnikov fractional derivative Krylov subspace-based model order reduction algorithm efficiency analysis relative error analysis algorithm convergence analysis computational complexity analysis finite difference method scheme BJT modelling self-heating silicon carbide SPICE IGBT DC–DC converter electrothermal model averaged model thermal phenomena diode–transistor switch power electronics multi-LED lighting modules device thermal coupling compact thermal models temperature sensors microprocessor throughput improvement inductors ferromagnetic cores thermal model transient thermal impedance thermal resistance electrothermal (ET) simulation finite-element method (FEM) model-order reduction (MOR) multicellular power MOSFET silicon carbide (SiC) thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| url | ONIX_20210501_9783036503349_236 |