Electromagnetic Interference and Compatibility
Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnet...
Đã lưu trong:
| Định dạng: | Online |
|---|---|
| Ngôn ngữ: | Tiếng Anh |
| Được phát hành: |
MDPI - Multidisciplinary Digital Publishing Institute
2022
|
| Những chủ đề: | |
| Truy cập trực tuyến: | ONIX_20220111_9783036505008_144 |
| Các nhãn: |
Không có thẻ, Là người đầu tiên thẻ bản ghi này!
|
| _version_ | 1869522818107965440 |
|---|---|
| collection | Directory of Open Access Books |
| description | Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials. |
| format | Online |
| id | doab-20.500.12854ir-76408 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2022 |
| publishDateRange | 2022 |
| publishDateSort | 2022 |
| publisher | MDPI - Multidisciplinary Digital Publishing Institute |
| publisherStr | MDPI - Multidisciplinary Digital Publishing Institute |
| record_format | ojs |
| spelling | doab-20.500.12854ir-764082024-04-09T23:15:53Z Electromagnetic Interference and Compatibility Crovetti, Paolo Stefano electromagnetic bandgap (EBG) dual perforation (DP) parallel-plate noise power delivery network (PDN) printed circuit board (PCB) meander split power/ground plane crosstalk signal integrity equivalent circuit capacitive and magnetic coupling hall-effect current sensors commercial current sensor electromagnetic compatibility (EMC) electromagnetic interference (EMI) direct power injection (DPI) test transverse-electromagnetic (TEM) test bulk current injection (BCI) test Spread Spectrum DC–DC power converters digital communications channel capacity resonant coupling Electromagnetic Interferences Amplifiers CMOS integrated circuits susceptibility of the output pin electromagnetic compatibility power electronics EMC EMI mitigation techniques EMI filter design and optimization common mode noise EMI modeling Fourier series impedance balancing resonant frequency battery management system (BMS) Li-ion battery pack electric vehicles (EVs) hybrid electric vehicles (HEVs) IC-level EMC susceptibility to electromagnetic interference (EMI) direct power injection (DPI) anechoic chamber polyaniline gelatin composite microwave absorption dielectric permittivity electrical conductivity shielding effectiveness biochar eco-friendly material cementitious composites waveguides electromagnetic interference (EMI) suppressors sleeve ferrite cores cable filtering nanocrystalline (NC) split-core snap ferrite gap DC currents relative permeability impedance conducted emissions Discrete Wavelet Transform electromagnetic interference Empirical Mode Decomposition harmonics Switched-Mode Power Supplies transients Wavelet Packet Transform thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::K Economics, Finance, Business and Management::KN Industry and industrial studies::KNB Energy industries and utilities Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials. 2022-01-11T13:31:08Z 2022-01-11T13:31:08Z 2021 book ONIX_20220111_9783036505008_144 9783036505008 9783036505015 https://directory.doabooks.org/handle/20.500.12854/76408 eng image/jpeg Attribution 4.0 International https://mdpi.com/books/pdfview/book/3843 https://mdpi.com/books/pdfview/book/3843 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-0365-0501-5 10.3390/books978-3-0365-0501-5 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783036505008 9783036505015 206 Basel, Switzerland open access |
| spellingShingle | electromagnetic bandgap (EBG) dual perforation (DP) parallel-plate noise power delivery network (PDN) printed circuit board (PCB) meander split power/ground plane crosstalk signal integrity equivalent circuit capacitive and magnetic coupling hall-effect current sensors commercial current sensor electromagnetic compatibility (EMC) electromagnetic interference (EMI) direct power injection (DPI) test transverse-electromagnetic (TEM) test bulk current injection (BCI) test Spread Spectrum DC–DC power converters digital communications channel capacity resonant coupling Electromagnetic Interferences Amplifiers CMOS integrated circuits susceptibility of the output pin electromagnetic compatibility power electronics EMC EMI mitigation techniques EMI filter design and optimization common mode noise EMI modeling Fourier series impedance balancing resonant frequency battery management system (BMS) Li-ion battery pack electric vehicles (EVs) hybrid electric vehicles (HEVs) IC-level EMC susceptibility to electromagnetic interference (EMI) direct power injection (DPI) anechoic chamber polyaniline gelatin composite microwave absorption dielectric permittivity electrical conductivity shielding effectiveness biochar eco-friendly material cementitious composites waveguides electromagnetic interference (EMI) suppressors sleeve ferrite cores cable filtering nanocrystalline (NC) split-core snap ferrite gap DC currents relative permeability impedance conducted emissions Discrete Wavelet Transform electromagnetic interference Empirical Mode Decomposition harmonics Switched-Mode Power Supplies transients Wavelet Packet Transform thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::K Economics, Finance, Business and Management::KN Industry and industrial studies::KNB Energy industries and utilities Electromagnetic Interference and Compatibility |
| title | Electromagnetic Interference and Compatibility |
| title_full | Electromagnetic Interference and Compatibility |
| title_fullStr | Electromagnetic Interference and Compatibility |
| title_full_unstemmed | Electromagnetic Interference and Compatibility |
| title_short | Electromagnetic Interference and Compatibility |
| title_sort | electromagnetic interference and compatibility |
| topic | electromagnetic bandgap (EBG) dual perforation (DP) parallel-plate noise power delivery network (PDN) printed circuit board (PCB) meander split power/ground plane crosstalk signal integrity equivalent circuit capacitive and magnetic coupling hall-effect current sensors commercial current sensor electromagnetic compatibility (EMC) electromagnetic interference (EMI) direct power injection (DPI) test transverse-electromagnetic (TEM) test bulk current injection (BCI) test Spread Spectrum DC–DC power converters digital communications channel capacity resonant coupling Electromagnetic Interferences Amplifiers CMOS integrated circuits susceptibility of the output pin electromagnetic compatibility power electronics EMC EMI mitigation techniques EMI filter design and optimization common mode noise EMI modeling Fourier series impedance balancing resonant frequency battery management system (BMS) Li-ion battery pack electric vehicles (EVs) hybrid electric vehicles (HEVs) IC-level EMC susceptibility to electromagnetic interference (EMI) direct power injection (DPI) anechoic chamber polyaniline gelatin composite microwave absorption dielectric permittivity electrical conductivity shielding effectiveness biochar eco-friendly material cementitious composites waveguides electromagnetic interference (EMI) suppressors sleeve ferrite cores cable filtering nanocrystalline (NC) split-core snap ferrite gap DC currents relative permeability impedance conducted emissions Discrete Wavelet Transform electromagnetic interference Empirical Mode Decomposition harmonics Switched-Mode Power Supplies transients Wavelet Packet Transform thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::K Economics, Finance, Business and Management::KN Industry and industrial studies::KNB Energy industries and utilities |
| topic_facet | electromagnetic bandgap (EBG) dual perforation (DP) parallel-plate noise power delivery network (PDN) printed circuit board (PCB) meander split power/ground plane crosstalk signal integrity equivalent circuit capacitive and magnetic coupling hall-effect current sensors commercial current sensor electromagnetic compatibility (EMC) electromagnetic interference (EMI) direct power injection (DPI) test transverse-electromagnetic (TEM) test bulk current injection (BCI) test Spread Spectrum DC–DC power converters digital communications channel capacity resonant coupling Electromagnetic Interferences Amplifiers CMOS integrated circuits susceptibility of the output pin electromagnetic compatibility power electronics EMC EMI mitigation techniques EMI filter design and optimization common mode noise EMI modeling Fourier series impedance balancing resonant frequency battery management system (BMS) Li-ion battery pack electric vehicles (EVs) hybrid electric vehicles (HEVs) IC-level EMC susceptibility to electromagnetic interference (EMI) direct power injection (DPI) anechoic chamber polyaniline gelatin composite microwave absorption dielectric permittivity electrical conductivity shielding effectiveness biochar eco-friendly material cementitious composites waveguides electromagnetic interference (EMI) suppressors sleeve ferrite cores cable filtering nanocrystalline (NC) split-core snap ferrite gap DC currents relative permeability impedance conducted emissions Discrete Wavelet Transform electromagnetic interference Empirical Mode Decomposition harmonics Switched-Mode Power Supplies transients Wavelet Packet Transform thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::K Economics, Finance, Business and Management::KN Industry and industrial studies::KNB Energy industries and utilities |
| url | ONIX_20220111_9783036505008_144 |