Hybrid Planar

Traditionally, high-performance communication systems were based on rectangular waveguides (RWGs) to guide high-frequency signals. Newer, efficient RWG-like systems are now available with the added value of low cost, low volume and low weight, together with compactness and ease of manufacture. These...

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Sprache:Englisch
Veröffentlicht: IntechOpen 2023
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collection Directory of Open Access Books
description Traditionally, high-performance communication systems were based on rectangular waveguides (RWGs) to guide high-frequency signals. Newer, efficient RWG-like systems are now available with the added value of low cost, low volume and low weight, together with compactness and ease of manufacture. These systems are based on substrate-integrated waveguides (SIWs), empty SIW (ESIW) and their multiple variations. This book presents successful examples of the use of these systems and the advances in their manufacture, as well as newer techniques that combine 3D metal/plastic printers with the most common planar procedures. The result is a variety of waveguide topologies, applications and manufacturing procedures that may have a strong influence on the design of communication devices and systems.
format Online
id doab-20.500.12854ir-97341
institution Directory of Open Access Books
language eng
publishDate 2023
publishDateRange 2023
publishDateSort 2023
publisher IntechOpen
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spelling doab-20.500.12854ir-973412024-04-11T20:33:45Z Hybrid Planar Fernandez, Marcos D. Ballesteros, José A. Esteban, Héctor Belenguer, Ángel Electronics & communications engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFD Electronic devices and materials Traditionally, high-performance communication systems were based on rectangular waveguides (RWGs) to guide high-frequency signals. Newer, efficient RWG-like systems are now available with the added value of low cost, low volume and low weight, together with compactness and ease of manufacture. These systems are based on substrate-integrated waveguides (SIWs), empty SIW (ESIW) and their multiple variations. This book presents successful examples of the use of these systems and the advances in their manufacture, as well as newer techniques that combine 3D metal/plastic printers with the most common planar procedures. The result is a variety of waveguide topologies, applications and manufacturing procedures that may have a strong influence on the design of communication devices and systems. 2023-02-15T14:58:52Z 2023-02-15T14:58:52Z 2023 book ONIX_20230215_9781803561509_379 9781803561509 9781803561493 9781803561516 https://directory.doabooks.org/handle/20.500.12854/97341 eng image/jpeg n/a https://www.intechopen.com/books/11511 https://mts.intechopen.com/storage/books/11511/authors_book/authors_book.pdf IntechOpen IntechOpen 10.5772/intechopen.100731 10.5772/intechopen.100731 78a36484-2c0c-47cb-ad67-2b9f5cd4a8f6 9781803561509 9781803561493 9781803561516 IntechOpen 182 open access
spellingShingle Electronics & communications engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFD Electronic devices and materials
Hybrid Planar
title Hybrid Planar
title_full Hybrid Planar
title_fullStr Hybrid Planar
title_full_unstemmed Hybrid Planar
title_short Hybrid Planar
title_sort hybrid planar
topic Electronics & communications engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFD Electronic devices and materials
topic_facet Electronics & communications engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFD Electronic devices and materials
url ONIX_20230215_9781803561509_379