Gelijkaardige items: Advanced Interconnect and Packaging
- Advanced Interconnect and Packaging
- MEMS Packaging Technologies and 3D Integration
- 2D Nanomaterials Processing and Integration in Miniaturized Devices
- Catalysis by Precious Metals, Past and Future
- Advances in Hard-to-Cut Materials: Manufacturing, Properties, Process Mechanics and Evaluation of Surface Integrity
- Obtaining and Characterization of New Materials