Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...

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Bibliografiska uppgifter
Huvudupphov: Lindenmann, Nicole
Materialtyp: Online
Språk:engelska
Utgiven: KIT Scientific Publishing 2021
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Länkar:34202
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