Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...
Zapisane w:
| 1. autor: | |
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| Format: | Online |
| Język: | angielski |
| Wydane: |
KIT Scientific Publishing
2021
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| Hasła przedmiotowe: | |
| Dostęp online: | 34202 |
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