Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...
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| Format: | Online |
| Language: | English |
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KIT Scientific Publishing
2021
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| Online Access: | 34202 |
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| _version_ | 1869522797268566016 |
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| author | Lindenmann, Nicole |
| author_browse | Lindenmann, Nicole |
| author_facet | Lindenmann, Nicole |
| author_sort | Lindenmann, Nicole |
| collection | Directory of Open Access Books |
| description | To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments. |
| format | Online |
| id | doab-20.500.12854ir-56210 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2021 |
| publishDateRange | 2021 |
| publishDateSort | 2021 |
| publisher | KIT Scientific Publishing |
| publisherStr | KIT Scientific Publishing |
| record_format | ojs |
| spelling | doab-20.500.12854ir-562102024-04-09T23:16:46Z Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces Lindenmann, Nicole T1-995 optische Aufbau- und Verbindungstechnik Photonic Wire Bonding optical interconnects photonic integrated circuits integrierte Photonik Silizium-Photonik silicon photonics photonic wire bonding thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments. 2021-02-11T22:51:26Z 2021-02-11T22:51:26Z 2019-07-28 18:37:01 2018 book 34202 18651100 9783731507468 https://directory.doabooks.org/handle/20.500.12854/56210 eng Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ) image/jpeg Attribution-ShareAlike 4.0 International https://www.ksp.kit.edu/9783731507468 KIT Scientific Publishing 10.5445/KSP/1000077963 10.5445/KSP/1000077963 68fffc18-8f7b-44fa-ac7e-0b7d7d979bd2 9783731507468 XXI, 222 p. open access |
| spellingShingle | T1-995 optische Aufbau- und Verbindungstechnik Photonic Wire Bonding optical interconnects photonic integrated circuits integrierte Photonik Silizium-Photonik silicon photonics photonic wire bonding thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues Lindenmann, Nicole Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces |
| title | Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces |
| title_full | Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces |
| title_fullStr | Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces |
| title_full_unstemmed | Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces |
| title_short | Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces |
| title_sort | photonic wire bonding as a novel technology for photonic chip interfaces |
| topic | T1-995 optische Aufbau- und Verbindungstechnik Photonic Wire Bonding optical interconnects photonic integrated circuits integrierte Photonik Silizium-Photonik silicon photonics photonic wire bonding thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues |
| topic_facet | T1-995 optische Aufbau- und Verbindungstechnik Photonic Wire Bonding optical interconnects photonic integrated circuits integrierte Photonik Silizium-Photonik silicon photonics photonic wire bonding thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues |
| url | 34202 |
| work_keys_str_mv | AT lindenmannnicole photonicwirebondingasanoveltechnologyforphotonicchipinterfaces |