Memory Nanomaterials

This Special Issue is designed to guide readers through the forefront of 21st-century storage technologies. Beginning with the physical limits of traditional semiconductor technology, we concentrate on breakthrough principles, novel materials, and innovative structures—encompassing silicon heterostr...

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प्रकाशित: MDPI - Multidisciplinary Digital Publishing Institute 2025
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ऑनलाइन पहुंच:ONIX_20250812T110751_9783725842858_413
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collection Directory of Open Access Books
description This Special Issue is designed to guide readers through the forefront of 21st-century storage technologies. Beginning with the physical limits of traditional semiconductor technology, we concentrate on breakthrough principles, novel materials, and innovative structures—encompassing silicon heterostructures and nanostructures, advances in nanostructure processing and integration for DRAM, as well as emerging DRAM architectures. At the same time, the materials and device mechanisms of a variety of next-generation memories—including resistive RAM (RRAM), phase-change memory (PCM), magnetoresistive RAM (MRAM) and ferroelectric RAM (FRAM)—are explored. Topics such as reliability analysis and nanostructure characterization, materials computation and device simulation, logic-memory 3D integration, and innovative memory applications present studies from material growth and device fabrication to performance evaluation. We have invited leading experts in the field to share their insights and latest findings, collectively charting a blueprint for high-performance, energy-efficient, and highly scalable memory technologies that will drive the information age toward smarter, greener, and more efficient storage solutions.
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institution Directory of Open Access Books
language eng
publishDate 2025
publishDateRange 2025
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publisher MDPI - Multidisciplinary Digital Publishing Institute
publisherStr MDPI - Multidisciplinary Digital Publishing Institute
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spelling doab-20.500.12854ir-1656582025-08-12T10:04:25Z Memory Nanomaterials Zhao, Chao Wang, Guilei Li, Huihui 3D sequential integration low thermal budget Schottky S/D FinFETs inverter phase change memory phase change material high speed thermal stability spin wave transistor spin wave filter voltage modulated resistive random-access memory (RRAM) sol-gel strontium zirconate titanium spin-transfer torque easy-cone magnetization precession switching current overdrive write error rate reliability hot carrier degradation (HCD) Si p-FinFETs gate-induced drain leakage (GIDL) recovery oxide trap generation energy distribution ferroelectrics ZrO2–HfO2 interlayer laminated structure endurance oxygen vacancy vertical channel transistor self-aligned laser annealing recrystallization Si cap vertical nanosheet ferroelectric domain size GAA selective etch silicon germanium etch effect process simulation thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general This Special Issue is designed to guide readers through the forefront of 21st-century storage technologies. Beginning with the physical limits of traditional semiconductor technology, we concentrate on breakthrough principles, novel materials, and innovative structures—encompassing silicon heterostructures and nanostructures, advances in nanostructure processing and integration for DRAM, as well as emerging DRAM architectures. At the same time, the materials and device mechanisms of a variety of next-generation memories—including resistive RAM (RRAM), phase-change memory (PCM), magnetoresistive RAM (MRAM) and ferroelectric RAM (FRAM)—are explored. Topics such as reliability analysis and nanostructure characterization, materials computation and device simulation, logic-memory 3D integration, and innovative memory applications present studies from material growth and device fabrication to performance evaluation. We have invited leading experts in the field to share their insights and latest findings, collectively charting a blueprint for high-performance, energy-efficient, and highly scalable memory technologies that will drive the information age toward smarter, greener, and more efficient storage solutions. 2025-08-12T10:04:23Z 2025-08-12T10:04:23Z 2025 book ONIX_20250812T110751_9783725842858_413 9783725842858 9783725842865 https://directory.doabooks.org/handle/20.500.12854/165658 eng image/jpeg Attribution 4.0 International https://mdpi.com/books https://mdpi.com/books/pdfview/book/11091 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-7258-4286-5 10.3390/books978-3-7258-4286-5 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783725842858 9783725842865 124 open access
spellingShingle 3D sequential integration
low thermal budget
Schottky S/D FinFETs
inverter
phase change memory
phase change material
high speed
thermal stability
spin wave transistor
spin wave filter
voltage modulated
resistive random-access memory (RRAM)
sol-gel
strontium zirconate titanium
spin-transfer torque
easy-cone magnetization
precession switching
current overdrive
write error rate
reliability
hot carrier degradation (HCD)
Si p-FinFETs
gate-induced drain leakage (GIDL)
recovery
oxide trap generation
energy distribution
ferroelectrics
ZrO2–HfO2
interlayer
laminated structure
endurance
oxygen vacancy
vertical channel transistor
self-aligned
laser annealing
recrystallization
Si cap
vertical nanosheet
ferroelectric
domain size
GAA
selective etch
silicon germanium
etch effect
process simulation
thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general
Memory Nanomaterials
title Memory Nanomaterials
title_full Memory Nanomaterials
title_fullStr Memory Nanomaterials
title_full_unstemmed Memory Nanomaterials
title_short Memory Nanomaterials
title_sort memory nanomaterials
topic 3D sequential integration
low thermal budget
Schottky S/D FinFETs
inverter
phase change memory
phase change material
high speed
thermal stability
spin wave transistor
spin wave filter
voltage modulated
resistive random-access memory (RRAM)
sol-gel
strontium zirconate titanium
spin-transfer torque
easy-cone magnetization
precession switching
current overdrive
write error rate
reliability
hot carrier degradation (HCD)
Si p-FinFETs
gate-induced drain leakage (GIDL)
recovery
oxide trap generation
energy distribution
ferroelectrics
ZrO2–HfO2
interlayer
laminated structure
endurance
oxygen vacancy
vertical channel transistor
self-aligned
laser annealing
recrystallization
Si cap
vertical nanosheet
ferroelectric
domain size
GAA
selective etch
silicon germanium
etch effect
process simulation
thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general
topic_facet 3D sequential integration
low thermal budget
Schottky S/D FinFETs
inverter
phase change memory
phase change material
high speed
thermal stability
spin wave transistor
spin wave filter
voltage modulated
resistive random-access memory (RRAM)
sol-gel
strontium zirconate titanium
spin-transfer torque
easy-cone magnetization
precession switching
current overdrive
write error rate
reliability
hot carrier degradation (HCD)
Si p-FinFETs
gate-induced drain leakage (GIDL)
recovery
oxide trap generation
energy distribution
ferroelectrics
ZrO2–HfO2
interlayer
laminated structure
endurance
oxygen vacancy
vertical channel transistor
self-aligned
laser annealing
recrystallization
Si cap
vertical nanosheet
ferroelectric
domain size
GAA
selective etch
silicon germanium
etch effect
process simulation
thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general
url ONIX_20250812T110751_9783725842858_413