Reliability Analysis of Electrotechnical Devices
This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.
I tiakina i:
| Hōputu: | Online |
|---|---|
| Reo: | Ingarihi |
| I whakaputaina: |
MDPI - Multidisciplinary Digital Publishing Institute
2022
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| Ngā marau: | |
| Urunga tuihono: | ONIX_20220812_9783036546537_89 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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| _version_ | 1869523296196755456 |
|---|---|
| collection | Directory of Open Access Books |
| description | This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards. |
| format | Online |
| id | doab-20.500.12854ir-91210 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2022 |
| publishDateRange | 2022 |
| publishDateSort | 2022 |
| publisher | MDPI - Multidisciplinary Digital Publishing Institute |
| publisherStr | MDPI - Multidisciplinary Digital Publishing Institute |
| record_format | ojs |
| spelling | doab-20.500.12854ir-912102024-04-09T23:16:09Z Reliability Analysis of Electrotechnical Devices Tan, Cher Ming 3D-IC (three-dimensional integrated circuit) electromagnetic interference near field measurement SAC305 BGA low temperature fracture failure factorial design of experiment genetic algorithm optimization return loss multiple-input multiple-output (MIMO) single event effects linear energy transfer Monte Carlo simulation radiation hardness pressureless sintered micron silver joints deep space environment extreme thermal shocks reconstruction simulation elastic mechanical properties state of health remaining useful life electrochemistry based electrical model semi-empirical capacity fading model useful life distribution quality and reliability assurance single event effect microdosimetry lineal energy deconvolution gamma process lifetime measurement system analysis reliability estimation GaN operational amplifier proton therapy prompt gamma imaging 3D X-ray bias temperature-humidity reliability test conductive anodic filament (CAF) de-penalization finite element analysis n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards. 2022-08-12T12:51:12Z 2022-08-12T12:51:12Z 2022 book ONIX_20220812_9783036546537_89 9783036546537 9783036546544 https://directory.doabooks.org/handle/20.500.12854/91210 eng image/jpeg Attribution 4.0 International https://mdpi.com/books/pdfview/book/5856 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-0365-4654-4 10.3390/books978-3-0365-4654-4 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783036546537 9783036546544 174 Basel open access |
| spellingShingle | 3D-IC (three-dimensional integrated circuit) electromagnetic interference near field measurement SAC305 BGA low temperature fracture failure factorial design of experiment genetic algorithm optimization return loss multiple-input multiple-output (MIMO) single event effects linear energy transfer Monte Carlo simulation radiation hardness pressureless sintered micron silver joints deep space environment extreme thermal shocks reconstruction simulation elastic mechanical properties state of health remaining useful life electrochemistry based electrical model semi-empirical capacity fading model useful life distribution quality and reliability assurance single event effect microdosimetry lineal energy deconvolution gamma process lifetime measurement system analysis reliability estimation GaN operational amplifier proton therapy prompt gamma imaging 3D X-ray bias temperature-humidity reliability test conductive anodic filament (CAF) de-penalization finite element analysis n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology Reliability Analysis of Electrotechnical Devices |
| title | Reliability Analysis of Electrotechnical Devices |
| title_full | Reliability Analysis of Electrotechnical Devices |
| title_fullStr | Reliability Analysis of Electrotechnical Devices |
| title_full_unstemmed | Reliability Analysis of Electrotechnical Devices |
| title_short | Reliability Analysis of Electrotechnical Devices |
| title_sort | reliability analysis of electrotechnical devices |
| topic | 3D-IC (three-dimensional integrated circuit) electromagnetic interference near field measurement SAC305 BGA low temperature fracture failure factorial design of experiment genetic algorithm optimization return loss multiple-input multiple-output (MIMO) single event effects linear energy transfer Monte Carlo simulation radiation hardness pressureless sintered micron silver joints deep space environment extreme thermal shocks reconstruction simulation elastic mechanical properties state of health remaining useful life electrochemistry based electrical model semi-empirical capacity fading model useful life distribution quality and reliability assurance single event effect microdosimetry lineal energy deconvolution gamma process lifetime measurement system analysis reliability estimation GaN operational amplifier proton therapy prompt gamma imaging 3D X-ray bias temperature-humidity reliability test conductive anodic filament (CAF) de-penalization finite element analysis n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| topic_facet | 3D-IC (three-dimensional integrated circuit) electromagnetic interference near field measurement SAC305 BGA low temperature fracture failure factorial design of experiment genetic algorithm optimization return loss multiple-input multiple-output (MIMO) single event effects linear energy transfer Monte Carlo simulation radiation hardness pressureless sintered micron silver joints deep space environment extreme thermal shocks reconstruction simulation elastic mechanical properties state of health remaining useful life electrochemistry based electrical model semi-empirical capacity fading model useful life distribution quality and reliability assurance single event effect microdosimetry lineal energy deconvolution gamma process lifetime measurement system analysis reliability estimation GaN operational amplifier proton therapy prompt gamma imaging 3D X-ray bias temperature-humidity reliability test conductive anodic filament (CAF) de-penalization finite element analysis n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| url | ONIX_20220812_9783036546537_89 |