Hybrid photonic assemblies based on 3D-printed coupling structures
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...
में बचाया:
| मुख्य लेखक: | |
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| स्वरूप: | Online |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
KIT Scientific Publishing
2023
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| विषय: | |
| ऑनलाइन पहुंच: | https://library.oapen.org/handle/20.500.12657/62898 |
| टैग: |
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| _version_ | 1869525890733441024 |
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| author | Xu, Yilin |
| author_browse | Xu, Yilin |
| author_facet | Xu, Yilin |
| author_sort | Xu, Yilin |
| collection | Directory of Open Access Books |
| description | Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML). |
| format | Online |
| id | doab-20.500.12854ir-99915.2 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2023 |
| publishDateRange | 2023 |
| publishDateSort | 2023 |
| publisher | KIT Scientific Publishing |
| publisherStr | KIT Scientific Publishing |
| record_format | ojs |
| spelling | doab-20.500.12854ir-99915.22024-04-11T20:35:14Z Hybrid photonic assemblies based on 3D-printed coupling structures Xu, Yilin Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML). 2023-07-21T15:24:49Z 2023-05-03T04:02:38Z 2023-07-21T15:24:49Z 2023-05-02T14:39:21Z 2023 book https://library.oapen.org/handle/20.500.12657/62898 9783731512738 https://directory.doabooks.org/handle/20.500.12854/99915.2 eng Karlsruhe Series in Photonics & Communications open access application/octet-stream Attribution-ShareAlike 4.0 International https://library.oapen.org/bitstream/20.500.12657/62898/1/hybrid-photonic-assemblies-based-on-3d-printed-coupling-structures.pdf KIT Scientific Publishing 10.5445/KSP/1000154744 10.5445/KSP/1000154744 68fffc18-8f7b-44fa-ac7e-0b7d7d979bd2 9783731512738 292 open access |
| spellingShingle | Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering Xu, Yilin Hybrid photonic assemblies based on 3D-printed coupling structures |
| title | Hybrid photonic assemblies based on 3D-printed coupling structures |
| title_full | Hybrid photonic assemblies based on 3D-printed coupling structures |
| title_fullStr | Hybrid photonic assemblies based on 3D-printed coupling structures |
| title_full_unstemmed | Hybrid photonic assemblies based on 3D-printed coupling structures |
| title_short | Hybrid photonic assemblies based on 3D-printed coupling structures |
| title_sort | hybrid photonic assemblies based on 3d printed coupling structures |
| topic | Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering |
| topic_facet | Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering |
| url | https://library.oapen.org/handle/20.500.12657/62898 |
| work_keys_str_mv | AT xuyilin hybridphotonicassembliesbasedon3dprintedcouplingstructures |