Hybrid photonic assemblies based on 3D-printed coupling structures

Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...

पूर्ण विवरण

में बचाया:
ग्रंथसूची विवरण
मुख्य लेखक: Xu, Yilin
स्वरूप: Online
भाषा:अंग्रेज़ी
प्रकाशित: KIT Scientific Publishing 2023
विषय:
ऑनलाइन पहुंच:https://library.oapen.org/handle/20.500.12657/62898
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_version_ 1869525890733441024
author Xu, Yilin
author_browse Xu, Yilin
author_facet Xu, Yilin
author_sort Xu, Yilin
collection Directory of Open Access Books
description Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
format Online
id doab-20.500.12854ir-99915.2
institution Directory of Open Access Books
language eng
publishDate 2023
publishDateRange 2023
publishDateSort 2023
publisher KIT Scientific Publishing
publisherStr KIT Scientific Publishing
record_format ojs
spelling doab-20.500.12854ir-99915.22024-04-11T20:35:14Z Hybrid photonic assemblies based on 3D-printed coupling structures Xu, Yilin Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML). 2023-07-21T15:24:49Z 2023-05-03T04:02:38Z 2023-07-21T15:24:49Z 2023-05-02T14:39:21Z 2023 book https://library.oapen.org/handle/20.500.12657/62898 9783731512738 https://directory.doabooks.org/handle/20.500.12854/99915.2 eng Karlsruhe Series in Photonics & Communications open access application/octet-stream Attribution-ShareAlike 4.0 International https://library.oapen.org/bitstream/20.500.12657/62898/1/hybrid-photonic-assemblies-based-on-3d-printed-coupling-structures.pdf KIT Scientific Publishing 10.5445/KSP/1000154744 10.5445/KSP/1000154744 68fffc18-8f7b-44fa-ac7e-0b7d7d979bd2 9783731512738 292 open access
spellingShingle Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering
Xu, Yilin
Hybrid photonic assemblies based on 3D-printed coupling structures
title Hybrid photonic assemblies based on 3D-printed coupling structures
title_full Hybrid photonic assemblies based on 3D-printed coupling structures
title_fullStr Hybrid photonic assemblies based on 3D-printed coupling structures
title_full_unstemmed Hybrid photonic assemblies based on 3D-printed coupling structures
title_short Hybrid photonic assemblies based on 3D-printed coupling structures
title_sort hybrid photonic assemblies based on 3d printed coupling structures
topic Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering
topic_facet Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering
url https://library.oapen.org/handle/20.500.12657/62898
work_keys_str_mv AT xuyilin hybridphotonicassembliesbasedon3dprintedcouplingstructures