Kaupapa: n/a
Kaupapa: thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general
Ngā tūemi rite: Nanostructured Materials for Solar Cell Applications
Ngā tūemi rite: MEMS Packaging Technologies and 3D Integration
- Simulation and Reliability Assessment of Advanced Packaging
- Chapter MEMS Technologies Enabling the Future Wafer Test Systems
- Advanced Interconnect and Packaging
- Advanced Interconnect and Packaging
- Frontiers on Sustainable Food Packaging
- Experimental Research and Computational Analysis of Eco- and Bio-Materials