Contact related Failure Detection of Semiconductor Layer Stacks using an Acoustic Emission Test Method

The book provides the reader with a novel, non-destructive test method for mechanical damages in semiconductor structures that can arise when contacting connection pads of integrated circuits during probing on wafer level. Instead of time-consuming and costly failure analyzes using optical and elect...

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מידע ביבליוגרפי

מחבר ראשי:	Unterreitmeier, Marianne
פורמט:	Online
שפה:	אנגלית
יצא לאור:	FAU University Press 2025
נושאים:	emission sensor nano-indentation semiconductor technology chip thema EDItEUR::P Mathematics and Science::PD Science: general issues::PDG Industrial applications of scientific research and technological innovation thema EDItEUR::P Mathematics and Science::PD Science: general issues::PDT Nanosciences thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science::TGMT Testing of materials
גישה מקוונת:	ONIX_20250828T094736_9783961473069_34
תגים:	הוספת תג אין תגיות, היה/י הראשונ/ה לתייג את הרשומה!