Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements

In the scope of this work, a novel joining process was developed and investi-gated from both an application-driven and an academic point of view. The process utilises laser radiation to melt a CuSn-braze preform, which is subse-quently detached from a ceramic capillary via inert gas overpressure. Af...

Täydet tiedot

Bibliografiset tiedot

Päätekijä:	Stein, Stefan
Aineistotyyppi:	Online
Kieli:	englanti
Julkaistu:	FAU University Press 2025
Aiheet:	Löten Laser Brazing Actuator Verbindungstechnik Soldering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGB Mechanical engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGH Precision engineering and manufacturing thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJS Sensors
Linkit:	ONIX_20251120T102856_9783961475087_42
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