Diffusion Soldering for the High-temperature Packaging of Power Electronics

With advances in the new generation semiconductor materials and ever-increasing requirements for reliable power electronic modules at elevated temperatures, a major limitation is the lack of qualified high-temperature device-level packaging. This work gives an overview of optimization and evaluation...

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Detalles Bibliográficos

Autor principal:	Syed-Khaja, Aarief
Formato:	Online
Lenguaje:	inglés
Publicado:	FAU University Press 2025
Materias:	Prozessoptimierung Hochtemperatur Diffusionslöten Intermetallische Verbindungen Verbindungstechnik Leistungselektronik thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials
Acceso en línea:	ONIX_20251120T082002_9783961471638_9
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