Diffusion Soldering for the High-temperature Packaging of Power Electronics
With advances in the new generation semiconductor materials and ever-increasing requirements for reliable power electronic modules at elevated temperatures, a major limitation is the lack of qualified high-temperature device-level packaging. This work gives an overview of optimization and evaluation...
Furkejuvvon:
| Váldodahkki: | |
|---|---|
| Materiálatiipa: | Online |
| Giella: | eaŋgalasgiella |
| Almmustuhtton: |
FAU University Press
2025
|
| Fáttát: | |
| Liŋkkat: | ONIX_20251120T082002_9783961471638_9 |
| Fáddágilkorat: |
Eai fáddágilkorat, Lasit vuosttaš fáddágilkora!
|
| _version_ | 1869531311979364352 |
|---|---|
| author | Syed-Khaja, Aarief |
| author_browse | Syed-Khaja, Aarief |
| author_facet | Syed-Khaja, Aarief |
| author_sort | Syed-Khaja, Aarief |
| collection | Directory of Open Access Books |
| description | With advances in the new generation semiconductor materials and ever-increasing requirements for reliable power electronic modules at elevated temperatures, a major limitation is the lack of qualified high-temperature device-level packaging. This work gives an overview of optimization and evaluation of Cu-Sn based Transient Liquid Phase Soldering (TLPS), a variant of diffusion soldering to implement as a high-temperature die-attach technique for power electronics production with high level of flexibility and customization. The TLPS interconnects with enriched ƞ-Cu6Sn5 Intermetallic phase bondline were realized successfully with optimized temperature profiles. A comprehensive analysis was performed on the process-related issues of voids for the selected soldering technique and warpage for components of varying dimensions and metallizations. Further the quality of the produced joints was evaluated by thermo-mechanical loading followed by the characterization of thermal and mechanical stability. The applicability is checked with product and technology case studies and an outlook is given with comparison of the investigated production concepts. |
| format | Online |
| id | doab-20.500.12854ir-169031 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2025 |
| publishDateRange | 2025 |
| publishDateSort | 2025 |
| publisher | FAU University Press |
| publisherStr | FAU University Press |
| record_format | ojs |
| spelling | doab-20.500.12854ir-1690312025-11-22T05:09:06Z Diffusion Soldering for the High-temperature Packaging of Power Electronics Syed-Khaja, Aarief Prozessoptimierung Hochtemperatur Diffusionslöten Intermetallische Verbindungen Verbindungstechnik Leistungselektronik thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials With advances in the new generation semiconductor materials and ever-increasing requirements for reliable power electronic modules at elevated temperatures, a major limitation is the lack of qualified high-temperature device-level packaging. This work gives an overview of optimization and evaluation of Cu-Sn based Transient Liquid Phase Soldering (TLPS), a variant of diffusion soldering to implement as a high-temperature die-attach technique for power electronics production with high level of flexibility and customization. The TLPS interconnects with enriched ƞ-Cu6Sn5 Intermetallic phase bondline were realized successfully with optimized temperature profiles. A comprehensive analysis was performed on the process-related issues of voids for the selected soldering technique and warpage for components of varying dimensions and metallizations. Further the quality of the produced joints was evaluated by thermo-mechanical loading followed by the characterization of thermal and mechanical stability. The applicability is checked with product and technology case studies and an outlook is given with comparison of the investigated production concepts. 2025-11-21T05:02:04Z 2025-11-21T05:02:04Z 2025-11-20T07:24:30Z 2019 book ONIX_20251120T082002_9783961471638_9 https://library.oapen.org/handle/20.500.12657/108181 9783961471638 9783961471621 https://directory.doabooks.org/handle/20.500.12854/169031 eng FAU Studien aus dem Maschinenbau open access image/jpeg Attribution-NonCommercial 4.0 International https://library.oapen.org/bitstream/20.500.12657/108181/1/9783961471638.pdf FAU University Press 10.25593/978-3-96147-163-8 10.25593/978-3-96147-163-8 2c600dea-eece-4066-87be-da335e323fdb 9783961471638 9783961471621 202 Erlangen open access |
| spellingShingle | Prozessoptimierung Hochtemperatur Diffusionslöten Intermetallische Verbindungen Verbindungstechnik Leistungselektronik thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials Syed-Khaja, Aarief Diffusion Soldering for the High-temperature Packaging of Power Electronics |
| title | Diffusion Soldering for the High-temperature Packaging of Power Electronics |
| title_full | Diffusion Soldering for the High-temperature Packaging of Power Electronics |
| title_fullStr | Diffusion Soldering for the High-temperature Packaging of Power Electronics |
| title_full_unstemmed | Diffusion Soldering for the High-temperature Packaging of Power Electronics |
| title_short | Diffusion Soldering for the High-temperature Packaging of Power Electronics |
| title_sort | diffusion soldering for the high temperature packaging of power electronics |
| topic | Prozessoptimierung Hochtemperatur Diffusionslöten Intermetallische Verbindungen Verbindungstechnik Leistungselektronik thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials |
| topic_facet | Prozessoptimierung Hochtemperatur Diffusionslöten Intermetallische Verbindungen Verbindungstechnik Leistungselektronik thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials |
| url | ONIX_20251120T082002_9783961471638_9 |
| work_keys_str_mv | AT syedkhajaaarief diffusionsolderingforthehightemperaturepackagingofpowerelectronics |