Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements
In the scope of this work, a novel joining process was developed and investi-gated from both an application-driven and an academic point of view. The process utilises laser radiation to melt a CuSn-braze preform, which is subse-quently detached from a ceramic capillary via inert gas overpressure. Af...
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| Formato: | Online |
| Idioma: | inglês |
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FAU University Press
2025
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| Acesso em linha: | ONIX_20251120T102856_9783961475087_42 |
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| _version_ | 1869524826565115904 |
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| author | Stein, Stefan |
| author_browse | Stein, Stefan |
| author_facet | Stein, Stefan |
| author_sort | Stein, Stefan |
| collection | Directory of Open Access Books |
| description | In the scope of this work, a novel joining process was developed and investi-gated from both an application-driven and an academic point of view. The process utilises laser radiation to melt a CuSn-braze preform, which is subse-quently detached from a ceramic capillary via inert gas overpressure. After a flight phase, the braze droplet impinges on the joining interface and wets the joining partners where it forms a metallurgical bond after solidification. This process is referred to as laser drop on demand joining (LDJ). It was shown that the shear strength of the joints exceeds the strength of standard tin-based solders by a factor of two and the joints are able to withstand the tempera-tures and forces occurring during an Al-Casting process. In addition, an ana-lytic model was developed, enabling to quantify the absorptance and thermal energy losses by heat convection, conduction, and radiation, by measuring the time required to melt the preform. |
| format | Online |
| id | doab-20.500.12854ir-169029 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2025 |
| publishDateRange | 2025 |
| publishDateSort | 2025 |
| publisher | FAU University Press |
| publisherStr | FAU University Press |
| record_format | ojs |
| spelling | doab-20.500.12854ir-1690292025-11-22T05:07:48Z Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements Stein, Stefan Löten Laser Brazing Actuator Verbindungstechnik Soldering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGB Mechanical engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGH Precision engineering and manufacturing thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJS Sensors In the scope of this work, a novel joining process was developed and investi-gated from both an application-driven and an academic point of view. The process utilises laser radiation to melt a CuSn-braze preform, which is subse-quently detached from a ceramic capillary via inert gas overpressure. After a flight phase, the braze droplet impinges on the joining interface and wets the joining partners where it forms a metallurgical bond after solidification. This process is referred to as laser drop on demand joining (LDJ). It was shown that the shear strength of the joints exceeds the strength of standard tin-based solders by a factor of two and the joints are able to withstand the tempera-tures and forces occurring during an Al-Casting process. In addition, an ana-lytic model was developed, enabling to quantify the absorptance and thermal energy losses by heat convection, conduction, and radiation, by measuring the time required to melt the preform. 2025-11-21T05:01:49Z 2025-11-21T05:01:49Z 2025-11-20T09:34:08Z 2022 book ONIX_20251120T102856_9783961475087_42 https://library.oapen.org/handle/20.500.12657/108254 9783961475087 9783961475070 https://directory.doabooks.org/handle/20.500.12854/169029 eng FAU Studien aus dem Maschinenbau open access image/jpeg Attribution-NonCommercial 4.0 International https://library.oapen.org/bitstream/20.500.12657/108254/1/9783961475087.pdf FAU University Press 10.25593/978-3-96147-508-7 10.25593/978-3-96147-508-7 2c600dea-eece-4066-87be-da335e323fdb 9783961475087 9783961475070 112 Erlangen open access |
| spellingShingle | Löten Laser Brazing Actuator Verbindungstechnik Soldering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGB Mechanical engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGH Precision engineering and manufacturing thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJS Sensors Stein, Stefan Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_full | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_fullStr | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_full_unstemmed | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_short | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_sort | laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| topic | Löten Laser Brazing Actuator Verbindungstechnik Soldering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGB Mechanical engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGH Precision engineering and manufacturing thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJS Sensors |
| topic_facet | Löten Laser Brazing Actuator Verbindungstechnik Soldering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGB Mechanical engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGH Precision engineering and manufacturing thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJS Sensors |
| url | ONIX_20251120T102856_9783961475087_42 |
| work_keys_str_mv | AT steinstefan laserdropondemandjoiningasbondingmethodforelectronicsassemblyandpackagingwithhighthermalrequirements |