Bearbmagovva

Advanced Interconnect and Packaging

Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...

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Furkejuvvon:
Materiálatiipa: Online
Giella:eaŋgalasgiella
Almmustuhtton: MDPI - Multidisciplinary Digital Publishing Institute 2023
Fáttát:
antenna current
transmission line model
frequency-selective surface analytical approximation
low-temperature soldering
3D IC
Bi aggregation
Sn-Bi solder
integrated circuit interconnects
aging
reliability
electromigration
physics-based modeling
average power handling capability (APHC)
slow-wave transmission line (SWTL)
thermal resistance
average heat-spreading width
temperature-dependent resistivity
broadside structure
far-end crosstalk
impedance
interposer channel
silicon interposer
vertical tabbed via
on-chip interconnect
carbon nanotube
through-silicon-via (TSV)
Cu-CNT composite
Cu–Sn bonding
Au–Au bonding
graphene
high-temperature pressure sensor
substrate integrated waveguide (SIW)
spoof surface plasmon polaritons (SSPPs)
integrated passive device
through-dielectric capacitor (TDC)
electromagnetic bandgap (EBG)
interposers
low-loss substrates
noise suppression structures
packages
power delivery network (PDN)
power/ground noise
Pt–Pt interconnection
high-temperature resistant packaging
metallic bonding
Au wire bonding
high-temperature annealing
focused ion beam (FIB)
morphology analysis
wettability
hot-melt glass
flow time
coverage thickness
SiO2 and Au substrate
MEMS sensor
reliability evaluation
vacuum degradation
mathematical model
parylene
blood oxygen
sensing array
wearable device
on-chip spiral inductor
circuit model
kinetic inductance
quantum resistance
frequency selective rasorber (FSR)
spoof surface plasmon polaritons (SSPP)
frequency selective surface (FSS)
broadband
dual active bridge
deadbeat controller
load feedforward
n/a
thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general
thema EDItEUR::P Mathematics and Science::PH Physics
Liŋkkat:ONIX_20230307_9783036567334_95
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