Advanced Interconnect and Packaging
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...
Gorde:
| Formatua: | Online |
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| Hizkuntza: | ingelesa |
| Argitaratua: |
MDPI - Multidisciplinary Digital Publishing Institute
2023
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| Gaiak: | |
| Sarrera elektronikoa: | ONIX_20230307_9783036567334_95 |
| Etiketak: |
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Antzeko izenburuak: Advanced Interconnect and Packaging
- Advanced Interconnect and Packaging
- MEMS Packaging Technologies and 3D Integration
- 2D Nanomaterials Processing and Integration in Miniaturized Devices
- Catalysis by Precious Metals, Past and Future
- Advances in Hard-to-Cut Materials: Manufacturing, Properties, Process Mechanics and Evaluation of Surface Integrity
- Obtaining and Characterization of New Materials