Խորագիր: 2.5D package
Նմանատիպ նյութեր: Simulation and Reliability Assessment of Advanced Packaging
- MEMS Packaging Technologies and 3D Integration
- علوم و فنون بسته بندی
- Millimeterwellen On-Chip Antennensysteme für die Integration in SoC Applikationen
- Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production
- Frontiers on Sustainable Food Packaging
- Journal of Applied Packaging Research