Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production

Surface Mount Technology (SMT) is the primary method of permanently mounting electronic components on a substrate. A decisive improvement in the quality of the connection technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering oven tec...

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Bibliografiska uppgifter
Huvudupphov: Esfandyari, Alireza
Materialtyp: Online
Språk:engelska
Utgiven: FAU University Press 2025
Ämnen:
Länkar:ONIX_20251120T102856_9783961473830_12
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