Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production
Surface Mount Technology (SMT) is the primary method of permanently mounting electronic components on a substrate. A decisive improvement in the quality of the connection technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering oven tec...
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| Materialtyp: | Online |
| Språk: | engelska |
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FAU University Press
2025
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| Länkar: | ONIX_20251120T102856_9783961473830_12 |
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