Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production

Surface Mount Technology (SMT) is the primary method of permanently mounting electronic components on a substrate. A decisive improvement in the quality of the connection technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering oven tec...

Full description

Bibliographic Details

Main Author:	Esfandyari, Alireza
Format:	Online
Language:	English
Published:	FAU University Press 2025
Subjects:	Electrical engineering Static analysis Multi-objective optimization Production Electronics Neural network Reflow soldering Resource efficiency thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering
Online Access:	ONIX_20251120T102856_9783961473830_12
Tags:	Add Tag No Tags, Be the first to tag this record!