Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production

Surface Mount Technology (SMT) is the primary method of permanently mounting electronic components on a substrate. A decisive improvement in the quality of the connection technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering oven tec...

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Autor principal:	Esfandyari, Alireza
Format:	Online
Idioma:	anglès
Publicat:	FAU University Press 2025
Matèries:	Electrical engineering Static analysis Multi-objective optimization Production Electronics Neural network Reflow soldering Resource efficiency thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering
Accés en línia:	ONIX_20251120T102856_9783961473830_12
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