Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production
Surface Mount Technology (SMT) is the primary method of permanently mounting electronic components on a substrate. A decisive improvement in the quality of the connection technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering oven tec...
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| Формат: | Online |
| Язык: | английский |
| Опубликовано: |
FAU University Press
2025
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| Предметы: | |
| Online-ссылка: | ONIX_20251120T102856_9783961473830_12 |
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| _version_ | 1869519746358050816 |
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| author | Esfandyari, Alireza |
| author_browse | Esfandyari, Alireza |
| author_facet | Esfandyari, Alireza |
| author_sort | Esfandyari, Alireza |
| collection | Directory of Open Access Books |
| description | Surface Mount Technology (SMT) is the primary method of permanently mounting electronic components on a substrate. A decisive improvement in the quality of the connection technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering oven technology in combination with an overpressure module enables void-free solder joints. However, the configuration of the process-related mechanism has not yet been fully investigated. In addition, the method offered in the market is energy-intensive, and a deep understanding of the resource flow into the process is mandatory if minimization of consumption is to be achieved. This study deals with a multi-criteria/overall optimization solution based on a trade-off model for quality, energy, cost and time criteria. The approach to find the optimal solution for each criterion is possible. However, a holistically optimized multi-criteria solution is not possible. Using significance analysis a criteria approach for the overpressure soldering process is defined to maximize or minimize each goal/criterion using Artificial Neural Network (ANN) modeling approach. A compromise model has been developed, which enables the decision maker to achieve the setup goal while considering the conflicting requirements in the best possible approach. |
| format | Online |
| id | doab-20.500.12854ir-169138 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2025 |
| publishDateRange | 2025 |
| publishDateSort | 2025 |
| publisher | FAU University Press |
| publisherStr | FAU University Press |
| record_format | ojs |
| spelling | doab-20.500.12854ir-1691382025-11-22T06:23:42Z Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production Esfandyari, Alireza Electrical engineering Static analysis Multi-objective optimization Production Electronics Neural network Reflow soldering Resource efficiency thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering Surface Mount Technology (SMT) is the primary method of permanently mounting electronic components on a substrate. A decisive improvement in the quality of the connection technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering oven technology in combination with an overpressure module enables void-free solder joints. However, the configuration of the process-related mechanism has not yet been fully investigated. In addition, the method offered in the market is energy-intensive, and a deep understanding of the resource flow into the process is mandatory if minimization of consumption is to be achieved. This study deals with a multi-criteria/overall optimization solution based on a trade-off model for quality, energy, cost and time criteria. The approach to find the optimal solution for each criterion is possible. However, a holistically optimized multi-criteria solution is not possible. Using significance analysis a criteria approach for the overpressure soldering process is defined to maximize or minimize each goal/criterion using Artificial Neural Network (ANN) modeling approach. A compromise model has been developed, which enables the decision maker to achieve the setup goal while considering the conflicting requirements in the best possible approach. 2025-11-21T05:20:33Z 2025-11-21T05:20:33Z 2025-11-20T09:32:44Z 2021 book ONIX_20251120T102856_9783961473830_12 https://library.oapen.org/handle/20.500.12657/108224 9783961473830 9783961473823 https://directory.doabooks.org/handle/20.500.12854/169138 eng FAU Studien aus dem Maschinenbau open access image/jpeg Attribution-NonCommercial 4.0 International https://library.oapen.org/bitstream/20.500.12657/108224/1/9783961473830.pdf FAU University Press 10.25593/978-3-96147-383-0 10.25593/978-3-96147-383-0 2c600dea-eece-4066-87be-da335e323fdb 9783961473830 9783961473823 175 Erlangen open access |
| spellingShingle | Electrical engineering Static analysis Multi-objective optimization Production Electronics Neural network Reflow soldering Resource efficiency thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering Esfandyari, Alireza Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production |
| title | Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production |
| title_full | Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production |
| title_fullStr | Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production |
| title_full_unstemmed | Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production |
| title_short | Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production |
| title_sort | multi objective process optimization for overpressure reflow soldering in electronics production |
| topic | Electrical engineering Static analysis Multi-objective optimization Production Electronics Neural network Reflow soldering Resource efficiency thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering |
| topic_facet | Electrical engineering Static analysis Multi-objective optimization Production Electronics Neural network Reflow soldering Resource efficiency thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGP Production and industrial engineering |
| url | ONIX_20251120T102856_9783961473830_12 |
| work_keys_str_mv | AT esfandyarialireza multiobjectiveprocessoptimizationforoverpressurereflowsolderinginelectronicsproduction |