Emne: mechanical properties
- Advances in the Experimentation and Numerical Modeling of Material Joining Processes
- Simulation and Reliability Assessment of Advanced Packaging
- Processing-Structure-Property Relationships in Metals
- High Entropy Materials: Challenges and Prospects
- Recent Developments in Non-conventional Welding of Materials
- Advances in High-Performance Non-ferrous Materials
Emne: microstructure
- Advances in the Experimentation and Numerical Modeling of Material Joining Processes
- Processing-Structure-Property Relationships in Metals
- High Entropy Materials: Challenges and Prospects
- Shape Memory Alloys 2020
- Recent Developments in Non-conventional Welding of Materials
- Advances in High-Performance Non-ferrous Materials
Forfatter: Montanari, Roberto
Forfatter: Varone, Alessandra
Lignende værker: Advances in the Experimentation and Numerical Modeling of Material Joining Processes
Lignende værker: Simulation and Reliability Assessment of Advanced Packaging
- MEMS Packaging Technologies and 3D Integration
- علوم و فنون بسته بندی
- Millimeterwellen On-Chip Antennensysteme für die Integration in SoC Applikationen
- Multi-Objective Process Optimization for Overpressure Reflow Soldering in Electronics Production
- Frontiers on Sustainable Food Packaging
- Journal of Applied Packaging Research