Simulation and Reliability Assessment of Advanced Packaging
Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved...
Tallennettuna:
| Aineistotyyppi: | Online |
|---|---|
| Kieli: | englanti |
| Julkaistu: |
MDPI - Multidisciplinary Digital Publishing Institute
2024
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| Aiheet: | |
| Linkit: | ONIX_20240514_9783725809721_550 |
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| _version_ | 1869528254745935872 |
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| collection | Directory of Open Access Books |
| description | Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint. |
| format | Online |
| id | doab-20.500.12854ir-137935 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2024 |
| publishDateRange | 2024 |
| publishDateSort | 2024 |
| publisher | MDPI - Multidisciplinary Digital Publishing Institute |
| publisherStr | MDPI - Multidisciplinary Digital Publishing Institute |
| record_format | ojs |
| spelling | doab-20.500.12854ir-1379352024-05-14T14:59:09Z Simulation and Reliability Assessment of Advanced Packaging Chiang, Kuo-Ning flip-chip package 2.5D package thermal warpage strain gauge electronic packaging dynamic storage modulus loss tangent optimization bivariate cut-HDMR semiconductor packaging central composite design R-squared relative average absolute error flip chip package on package finite element analysis viscoelastic behavior process-induced warpage trace mapping effective modeling solder joint fatigue risk estimation wafer level chip-scaled packaging artificial neural network recurrent neural network generic algorithm principle component analysis time/temperature-dependent nonlinearity MOSFET TSV annealing process carrier mobility estimation FEM simulation WLP AI machine learning ANN RNN SVR KRR KNN RF regression model electro-thermal coupling analysis power MOSFET inverter power loss circuit simulation computational fluid dynamics Foster thermal network Micro-Electro-Mechanical Systems moisture sensitivity level test reflow process finite element method cohesive zone model bonding strength precondition test low-temperature co-fired ceramics (LTCCs) dielectric constant dissipation factor numerical simulation thermal design thermal stress PVT growth AlN single crystals flip-chip process strip warpage bump Ag–In alloy pastes mechanical alloying power semiconductor packaging die attachment mechanical properties oxidation mechanism multiple reflows synchrotron composite solder Wafer-Level Package (WLP) Finite Element Analysis (FEA) Kernel Ridge Regression (KRR) Cluster algorithm micro-joints solid-state reaction intermetallic adhesion layer Equation-Informed Neural Networks advanced electronic packaging numerical Bayesian Inference constitutive equations Pb-free SAC305 solders thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint. 2024-05-14T14:59:06Z 2024-05-14T14:59:06Z 2024 book ONIX_20240514_9783725809721_550 9783725809721 9783725809714 https://directory.doabooks.org/handle/20.500.12854/137935 eng application/octet-stream Attribution-NonCommercial-NoDerivatives 4.0 International https://mdpi.com/books/pdfview/book/9200 https://mdpi.com/books/pdfview/book/9200 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-7258-0971-4 10.3390/books978-3-7258-0971-4 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783725809721 9783725809714 296 open access |
| spellingShingle | flip-chip package 2.5D package thermal warpage strain gauge electronic packaging dynamic storage modulus loss tangent optimization bivariate cut-HDMR semiconductor packaging central composite design R-squared relative average absolute error flip chip package on package finite element analysis viscoelastic behavior process-induced warpage trace mapping effective modeling solder joint fatigue risk estimation wafer level chip-scaled packaging artificial neural network recurrent neural network generic algorithm principle component analysis time/temperature-dependent nonlinearity MOSFET TSV annealing process carrier mobility estimation FEM simulation WLP AI machine learning ANN RNN SVR KRR KNN RF regression model electro-thermal coupling analysis power MOSFET inverter power loss circuit simulation computational fluid dynamics Foster thermal network Micro-Electro-Mechanical Systems moisture sensitivity level test reflow process finite element method cohesive zone model bonding strength precondition test low-temperature co-fired ceramics (LTCCs) dielectric constant dissipation factor numerical simulation thermal design thermal stress PVT growth AlN single crystals flip-chip process strip warpage bump Ag–In alloy pastes mechanical alloying power semiconductor packaging die attachment mechanical properties oxidation mechanism multiple reflows synchrotron composite solder Wafer-Level Package (WLP) Finite Element Analysis (FEA) Kernel Ridge Regression (KRR) Cluster algorithm micro-joints solid-state reaction intermetallic adhesion layer Equation-Informed Neural Networks advanced electronic packaging numerical Bayesian Inference constitutive equations Pb-free SAC305 solders thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues Simulation and Reliability Assessment of Advanced Packaging |
| title | Simulation and Reliability Assessment of Advanced Packaging |
| title_full | Simulation and Reliability Assessment of Advanced Packaging |
| title_fullStr | Simulation and Reliability Assessment of Advanced Packaging |
| title_full_unstemmed | Simulation and Reliability Assessment of Advanced Packaging |
| title_short | Simulation and Reliability Assessment of Advanced Packaging |
| title_sort | simulation and reliability assessment of advanced packaging |
| topic | flip-chip package 2.5D package thermal warpage strain gauge electronic packaging dynamic storage modulus loss tangent optimization bivariate cut-HDMR semiconductor packaging central composite design R-squared relative average absolute error flip chip package on package finite element analysis viscoelastic behavior process-induced warpage trace mapping effective modeling solder joint fatigue risk estimation wafer level chip-scaled packaging artificial neural network recurrent neural network generic algorithm principle component analysis time/temperature-dependent nonlinearity MOSFET TSV annealing process carrier mobility estimation FEM simulation WLP AI machine learning ANN RNN SVR KRR KNN RF regression model electro-thermal coupling analysis power MOSFET inverter power loss circuit simulation computational fluid dynamics Foster thermal network Micro-Electro-Mechanical Systems moisture sensitivity level test reflow process finite element method cohesive zone model bonding strength precondition test low-temperature co-fired ceramics (LTCCs) dielectric constant dissipation factor numerical simulation thermal design thermal stress PVT growth AlN single crystals flip-chip process strip warpage bump Ag–In alloy pastes mechanical alloying power semiconductor packaging die attachment mechanical properties oxidation mechanism multiple reflows synchrotron composite solder Wafer-Level Package (WLP) Finite Element Analysis (FEA) Kernel Ridge Regression (KRR) Cluster algorithm micro-joints solid-state reaction intermetallic adhesion layer Equation-Informed Neural Networks advanced electronic packaging numerical Bayesian Inference constitutive equations Pb-free SAC305 solders thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues |
| topic_facet | flip-chip package 2.5D package thermal warpage strain gauge electronic packaging dynamic storage modulus loss tangent optimization bivariate cut-HDMR semiconductor packaging central composite design R-squared relative average absolute error flip chip package on package finite element analysis viscoelastic behavior process-induced warpage trace mapping effective modeling solder joint fatigue risk estimation wafer level chip-scaled packaging artificial neural network recurrent neural network generic algorithm principle component analysis time/temperature-dependent nonlinearity MOSFET TSV annealing process carrier mobility estimation FEM simulation WLP AI machine learning ANN RNN SVR KRR KNN RF regression model electro-thermal coupling analysis power MOSFET inverter power loss circuit simulation computational fluid dynamics Foster thermal network Micro-Electro-Mechanical Systems moisture sensitivity level test reflow process finite element method cohesive zone model bonding strength precondition test low-temperature co-fired ceramics (LTCCs) dielectric constant dissipation factor numerical simulation thermal design thermal stress PVT growth AlN single crystals flip-chip process strip warpage bump Ag–In alloy pastes mechanical alloying power semiconductor packaging die attachment mechanical properties oxidation mechanism multiple reflows synchrotron composite solder Wafer-Level Package (WLP) Finite Element Analysis (FEA) Kernel Ridge Regression (KRR) Cluster algorithm micro-joints solid-state reaction intermetallic adhesion layer Equation-Informed Neural Networks advanced electronic packaging numerical Bayesian Inference constitutive equations Pb-free SAC305 solders thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues |
| url | ONIX_20240514_9783725809721_550 |