Simulation and Reliability Assessment of Advanced Packaging

Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved...

Ամբողջական նկարագրություն

Պահպանված է:

Մատենագիտական մանրամասներ
Ձևաչափ:	Online
Լեզու:	անգլերեն
Հրապարակվել է:	MDPI - Multidisciplinary Digital Publishing Institute 2024
Խորագրեր:	flip-chip package 2.5D package thermal warpage strain gauge electronic packaging dynamic storage modulus loss tangent optimization bivariate cut-HDMR semiconductor packaging central composite design R-squared relative average absolute error flip chip package on package finite element analysis viscoelastic behavior process-induced warpage trace mapping effective modeling solder joint fatigue risk estimation wafer level chip-scaled packaging artificial neural network recurrent neural network generic algorithm principle component analysis time/temperature-dependent nonlinearity MOSFET TSV annealing process carrier mobility estimation FEM simulation WLP AI machine learning ANN RNN SVR KRR KNN RF regression model electro-thermal coupling analysis power MOSFET inverter power loss circuit simulation computational fluid dynamics Foster thermal network Micro-Electro-Mechanical Systems moisture sensitivity level test reflow process finite element method cohesive zone model bonding strength precondition test low-temperature co-fired ceramics (LTCCs) dielectric constant dissipation factor numerical simulation thermal design thermal stress PVT growth AlN single crystals flip-chip process strip warpage bump Ag–In alloy pastes mechanical alloying power semiconductor packaging die attachment mechanical properties oxidation mechanism multiple reflows synchrotron composite solder Wafer-Level Package (WLP) Finite Element Analysis (FEA) Kernel Ridge Regression (KRR) Cluster algorithm micro-joints solid-state reaction intermetallic adhesion layer Equation-Informed Neural Networks advanced electronic packaging numerical Bayesian Inference constitutive equations Pb-free SAC305 solders thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
Առցանց հասանելիություն:	ONIX_20240514_9783725809721_550
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Simulation and Reliability Assessment of Advanced Packaging

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