Nanoparticle Engineering for Chemical-Mechanical Planarization

In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progres...

Descrición completa

Gardado en:
Detalles Bibliográficos
Main Authors: Paik, Ungyu, Park, Jea-Gun
Formato: Online
Idioma:inglés
Publicado: Taylor & Francis 2025
Subjects:
Acceso en liña:ONIX_20250512_9781000023220_84
Tags: Engadir etiqueta
Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!