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Nanoparticle Engineering for Chemical-Mechanical Planarization

In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progres...

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Main Authors: Paik, Ungyu, Park, Jea-Gun
Formato: Online
Idioma:inglês
Publicado em: Taylor & Francis 2025
Assuntos:
CMP Process
PAA Concentration
PAA Layer
Polishing Rate
PVP Polymer
Removal Rate
Film Thickness Variation
PVP
PAA Solution
NAND Flash Memory
PAA Chain
Electrokinetic Behavior
Pattern Density
Oxide Film
Ceria Particles
Poly Si Film
Pram
pH Iep
Nitride Film
Poly Si
Removal Depth
Higher Removal Rate
Contact Angle
Abrasive Particles
Nano Fumed Silica Particle
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TD Industrial chemistry and manufacturing technologies::TDC Industrial chemistry and chemical engineering
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TH Energy technology and engineering::THR Electrical engineering
thema EDItEUR::P Mathematics and Science
Acesso em linha:ONIX_20250512_9781000023220_84
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