MEMS Packaging Technologies and 3D Integration
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers...
I tiakina i:
| Hōputu: | Online |
|---|---|
| Reo: | Ingarihi |
| I whakaputaina: |
MDPI - Multidisciplinary Digital Publishing Institute
2022
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| Ngā marau: | |
| Urunga tuihono: | ONIX_20220621_9783036542584_10 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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| _version_ | 1869515106882158592 |
|---|---|
| collection | Directory of Open Access Books |
| description | This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation. |
| format | Online |
| id | doab-20.500.12854ir-84576 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2022 |
| publishDateRange | 2022 |
| publishDateSort | 2022 |
| publisher | MDPI - Multidisciplinary Digital Publishing Institute |
| publisherStr | MDPI - Multidisciplinary Digital Publishing Institute |
| record_format | ojs |
| spelling | doab-20.500.12854ir-845762024-03-28T03:33:12Z MEMS Packaging Technologies and 3D Integration Seok, Seonho heterogeneous integration wafer bonding wafer sealing room-temperature bonding Au-Au bonding surface activated bonding Au film thickness surface roughness microelectromechanical systems (MEMS) packaging inkjet printing redistribution layers capacitive micromachined ultrasound transducers (CMUT) fan-out wafer-level packaging (FOWLP) adhesion thin film metal parylene neural probe scotch tape test FEM MEMS resonator temperature coefficient thermal stress millimeter-wave redundant TSV equivalent circuit model S-parameters extraction technology evaluation MEMS and IC integration MCDM fuzzy AHP fuzzy VIKOR fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging thermal sensors TMOS sensor finite difference time domain optical and electromagnetics simulations finite element analysis ultrasonic bonding metal direct bonding microsystem integration biocompatible packaging implantable reliability Finite element method (FEM) simulation multilayer reactive bonding integrated nanostructure-multilayer reactive system spontaneous self-ignition self-propagating exothermic reaction Pd/Al reactive multilayer system Ni/Al reactive multilayer system low-temperature MEMS packaging crack propagation microbump deflection angle stress intensity factor (SIF) polymer packaging neural interface chronic implantation n/a thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general thema EDItEUR::P Mathematics and Science::PS Biology, life sciences This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation. 2022-06-21T09:06:45Z 2022-06-21T09:06:45Z 2022 book ONIX_20220621_9783036542584_10 9783036542584 9783036542577 https://directory.doabooks.org/handle/20.500.12854/84576 eng application/octet-stream Attribution 4.0 International https://mdpi.com/books/pdfview/book/5558 https://mdpi.com/books/pdfview/book/5558 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-0365-4257-7 10.3390/books978-3-0365-4257-7 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783036542584 9783036542577 210 open access |
| spellingShingle | heterogeneous integration wafer bonding wafer sealing room-temperature bonding Au-Au bonding surface activated bonding Au film thickness surface roughness microelectromechanical systems (MEMS) packaging inkjet printing redistribution layers capacitive micromachined ultrasound transducers (CMUT) fan-out wafer-level packaging (FOWLP) adhesion thin film metal parylene neural probe scotch tape test FEM MEMS resonator temperature coefficient thermal stress millimeter-wave redundant TSV equivalent circuit model S-parameters extraction technology evaluation MEMS and IC integration MCDM fuzzy AHP fuzzy VIKOR fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging thermal sensors TMOS sensor finite difference time domain optical and electromagnetics simulations finite element analysis ultrasonic bonding metal direct bonding microsystem integration biocompatible packaging implantable reliability Finite element method (FEM) simulation multilayer reactive bonding integrated nanostructure-multilayer reactive system spontaneous self-ignition self-propagating exothermic reaction Pd/Al reactive multilayer system Ni/Al reactive multilayer system low-temperature MEMS packaging crack propagation microbump deflection angle stress intensity factor (SIF) polymer packaging neural interface chronic implantation n/a thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general thema EDItEUR::P Mathematics and Science::PS Biology, life sciences MEMS Packaging Technologies and 3D Integration |
| title | MEMS Packaging Technologies and 3D Integration |
| title_full | MEMS Packaging Technologies and 3D Integration |
| title_fullStr | MEMS Packaging Technologies and 3D Integration |
| title_full_unstemmed | MEMS Packaging Technologies and 3D Integration |
| title_short | MEMS Packaging Technologies and 3D Integration |
| title_sort | mems packaging technologies and 3d integration |
| topic | heterogeneous integration wafer bonding wafer sealing room-temperature bonding Au-Au bonding surface activated bonding Au film thickness surface roughness microelectromechanical systems (MEMS) packaging inkjet printing redistribution layers capacitive micromachined ultrasound transducers (CMUT) fan-out wafer-level packaging (FOWLP) adhesion thin film metal parylene neural probe scotch tape test FEM MEMS resonator temperature coefficient thermal stress millimeter-wave redundant TSV equivalent circuit model S-parameters extraction technology evaluation MEMS and IC integration MCDM fuzzy AHP fuzzy VIKOR fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging thermal sensors TMOS sensor finite difference time domain optical and electromagnetics simulations finite element analysis ultrasonic bonding metal direct bonding microsystem integration biocompatible packaging implantable reliability Finite element method (FEM) simulation multilayer reactive bonding integrated nanostructure-multilayer reactive system spontaneous self-ignition self-propagating exothermic reaction Pd/Al reactive multilayer system Ni/Al reactive multilayer system low-temperature MEMS packaging crack propagation microbump deflection angle stress intensity factor (SIF) polymer packaging neural interface chronic implantation n/a thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general thema EDItEUR::P Mathematics and Science::PS Biology, life sciences |
| topic_facet | heterogeneous integration wafer bonding wafer sealing room-temperature bonding Au-Au bonding surface activated bonding Au film thickness surface roughness microelectromechanical systems (MEMS) packaging inkjet printing redistribution layers capacitive micromachined ultrasound transducers (CMUT) fan-out wafer-level packaging (FOWLP) adhesion thin film metal parylene neural probe scotch tape test FEM MEMS resonator temperature coefficient thermal stress millimeter-wave redundant TSV equivalent circuit model S-parameters extraction technology evaluation MEMS and IC integration MCDM fuzzy AHP fuzzy VIKOR fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging thermal sensors TMOS sensor finite difference time domain optical and electromagnetics simulations finite element analysis ultrasonic bonding metal direct bonding microsystem integration biocompatible packaging implantable reliability Finite element method (FEM) simulation multilayer reactive bonding integrated nanostructure-multilayer reactive system spontaneous self-ignition self-propagating exothermic reaction Pd/Al reactive multilayer system Ni/Al reactive multilayer system low-temperature MEMS packaging crack propagation microbump deflection angle stress intensity factor (SIF) polymer packaging neural interface chronic implantation n/a thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general thema EDItEUR::P Mathematics and Science::PS Biology, life sciences |
| url | ONIX_20220621_9783036542584_10 |