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MEMS Packaging Technologies and 3D Integration

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers...

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Формат: Online
Язык:английский
Опубликовано: MDPI - Multidisciplinary Digital Publishing Institute 2022
Предметы:
heterogeneous integration
wafer bonding
wafer sealing
room-temperature bonding
Au-Au bonding
surface activated bonding
Au film thickness
surface roughness
microelectromechanical systems (MEMS) packaging
inkjet printing
redistribution layers
capacitive micromachined ultrasound transducers (CMUT)
fan-out wafer-level packaging (FOWLP)
adhesion
thin film metal
parylene
neural probe
scotch tape test
FEM
MEMS resonator
temperature coefficient
thermal stress
millimeter-wave
redundant TSV
equivalent circuit model
S-parameters extraction
technology evaluation
MEMS and IC integration
MCDM
fuzzy AHP
fuzzy VIKOR
fan-out wafer-level package
finite element
glass substrate
reliability life
packaging-on-packaging
thermal sensors
TMOS sensor
finite difference time domain
optical and electromagnetics simulations
finite element analysis
ultrasonic bonding
metal direct bonding
microsystem integration
biocompatible packaging
implantable
reliability
Finite element method (FEM)
simulation
multilayer reactive bonding
integrated nanostructure-multilayer reactive system
spontaneous self-ignition
self-propagating exothermic reaction
Pd/Al reactive multilayer system
Ni/Al reactive multilayer system
low-temperature MEMS packaging
crack propagation
microbump
deflection angle
stress intensity factor (SIF)
polymer packaging
neural interface
chronic implantation
n/a
thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general
thema EDItEUR::P Mathematics and Science::PS Biology, life sciences
Online-ссылка:ONIX_20220621_9783036542584_10
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