Advanced Interconnect and Packaging
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...
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| Format: | Online |
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| Jezik: | engleski |
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MDPI - Multidisciplinary Digital Publishing Institute
2023
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| Teme: | |
| Online pristup: | ONIX_20230405_9783036567334_84 |
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| _version_ | 1869526869415559168 |
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| collection | Directory of Open Access Books |
| description | Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated circuits. To resolve these interconnect problems, various emerging technologies, including airgap, nanocarbon, optical, and through-silicon via (TSV), have been proposed and investigated. For example, by virtue of TSV technology, dies can be stacked to increase the integration density. More importantly, 3D integration and packaging also offer the most promising platform to implement "More-than-Moore" technologies, providing heterogeneous materials and technologies on a single chip. The "Advanced Interconnect and Packaging" Special Issue seeks to showcase research papers on new developments in advanced interconnect and packaging, i.e., on the design, modeling, fabrication, and reliability assessment of emerging interconnect and packaging technologies. Additionally, there are two interesting papers on carbon nanotube interconnects and interconnect reliability issues. |
| format | Online |
| id | doab-20.500.12854ir-98805 |
| institution | Directory of Open Access Books |
| language | eng |
| publishDate | 2023 |
| publishDateRange | 2023 |
| publishDateSort | 2023 |
| publisher | MDPI - Multidisciplinary Digital Publishing Institute |
| publisherStr | MDPI - Multidisciplinary Digital Publishing Institute |
| record_format | ojs |
| spelling | doab-20.500.12854ir-988052024-04-11T15:10:50Z Advanced Interconnect and Packaging Zhao, Wensheng antenna current transmission line model frequency-selective surface analytical approximation low-temperature soldering 3D IC Bi aggregation Sn-Bi solder integrated circuit interconnects aging reliability electromigration physics-based modeling average power handling capability (APHC) slow-wave transmission line (SWTL) thermal resistance average heat-spreading width temperature-dependent resistivity broadside structure far-end crosstalk impedance interposer channel silicon interposer vertical tabbed via on-chip interconnect carbon nanotube through-silicon-via (TSV) Cu-CNT composite Cu–Sn bonding Au–Au bonding graphene high-temperature pressure sensor substrate integrated waveguide (SIW) spoof surface plasmon polaritons (SSPPs) integrated passive device through-dielectric capacitor (TDC) electromagnetic bandgap (EBG) interposers low-loss substrates noise suppression structures packages power delivery network (PDN) power/ground noise Pt–Pt interconnection high-temperature resistant packaging metallic bonding Au wire bonding high-temperature annealing focused ion beam (FIB) morphology analysis wettability hot-melt glass flow time coverage thickness SiO2 and Au substrate MEMS sensor reliability evaluation vacuum degradation mathematical model parylene blood oxygen sensing array wearable device on-chip spiral inductor circuit model kinetic inductance quantum resistance frequency selective rasorber (FSR) spoof surface plasmon polaritons (SSPP) frequency selective surface (FSS) broadband dual active bridge deadbeat controller load feedforward n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated circuits. To resolve these interconnect problems, various emerging technologies, including airgap, nanocarbon, optical, and through-silicon via (TSV), have been proposed and investigated. For example, by virtue of TSV technology, dies can be stacked to increase the integration density. More importantly, 3D integration and packaging also offer the most promising platform to implement "More-than-Moore" technologies, providing heterogeneous materials and technologies on a single chip. The "Advanced Interconnect and Packaging" Special Issue seeks to showcase research papers on new developments in advanced interconnect and packaging, i.e., on the design, modeling, fabrication, and reliability assessment of emerging interconnect and packaging technologies. Additionally, there are two interesting papers on carbon nanotube interconnects and interconnect reliability issues. 2023-04-05T12:52:01Z 2023-04-05T12:52:01Z 2023 book ONIX_20230405_9783036567334_84 9783036567334 9783036567327 https://directory.doabooks.org/handle/20.500.12854/98805 eng application/octet-stream Attribution 4.0 International https://mdpi.com/books/pdfview/book/6847 https://mdpi.com/books/pdfview/book/6847 MDPI - Multidisciplinary Digital Publishing Institute 10.3390/books978-3-0365-6732-7 10.3390/books978-3-0365-6732-7 46cabcaa-dd94-4bfe-87b4-55023c1b36d0 9783036567334 9783036567327 266 Basel open access |
| spellingShingle | antenna current transmission line model frequency-selective surface analytical approximation low-temperature soldering 3D IC Bi aggregation Sn-Bi solder integrated circuit interconnects aging reliability electromigration physics-based modeling average power handling capability (APHC) slow-wave transmission line (SWTL) thermal resistance average heat-spreading width temperature-dependent resistivity broadside structure far-end crosstalk impedance interposer channel silicon interposer vertical tabbed via on-chip interconnect carbon nanotube through-silicon-via (TSV) Cu-CNT composite Cu–Sn bonding Au–Au bonding graphene high-temperature pressure sensor substrate integrated waveguide (SIW) spoof surface plasmon polaritons (SSPPs) integrated passive device through-dielectric capacitor (TDC) electromagnetic bandgap (EBG) interposers low-loss substrates noise suppression structures packages power delivery network (PDN) power/ground noise Pt–Pt interconnection high-temperature resistant packaging metallic bonding Au wire bonding high-temperature annealing focused ion beam (FIB) morphology analysis wettability hot-melt glass flow time coverage thickness SiO2 and Au substrate MEMS sensor reliability evaluation vacuum degradation mathematical model parylene blood oxygen sensing array wearable device on-chip spiral inductor circuit model kinetic inductance quantum resistance frequency selective rasorber (FSR) spoof surface plasmon polaritons (SSPP) frequency selective surface (FSS) broadband dual active bridge deadbeat controller load feedforward n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology Advanced Interconnect and Packaging |
| title | Advanced Interconnect and Packaging |
| title_full | Advanced Interconnect and Packaging |
| title_fullStr | Advanced Interconnect and Packaging |
| title_full_unstemmed | Advanced Interconnect and Packaging |
| title_short | Advanced Interconnect and Packaging |
| title_sort | advanced interconnect and packaging |
| topic | antenna current transmission line model frequency-selective surface analytical approximation low-temperature soldering 3D IC Bi aggregation Sn-Bi solder integrated circuit interconnects aging reliability electromigration physics-based modeling average power handling capability (APHC) slow-wave transmission line (SWTL) thermal resistance average heat-spreading width temperature-dependent resistivity broadside structure far-end crosstalk impedance interposer channel silicon interposer vertical tabbed via on-chip interconnect carbon nanotube through-silicon-via (TSV) Cu-CNT composite Cu–Sn bonding Au–Au bonding graphene high-temperature pressure sensor substrate integrated waveguide (SIW) spoof surface plasmon polaritons (SSPPs) integrated passive device through-dielectric capacitor (TDC) electromagnetic bandgap (EBG) interposers low-loss substrates noise suppression structures packages power delivery network (PDN) power/ground noise Pt–Pt interconnection high-temperature resistant packaging metallic bonding Au wire bonding high-temperature annealing focused ion beam (FIB) morphology analysis wettability hot-melt glass flow time coverage thickness SiO2 and Au substrate MEMS sensor reliability evaluation vacuum degradation mathematical model parylene blood oxygen sensing array wearable device on-chip spiral inductor circuit model kinetic inductance quantum resistance frequency selective rasorber (FSR) spoof surface plasmon polaritons (SSPP) frequency selective surface (FSS) broadband dual active bridge deadbeat controller load feedforward n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| topic_facet | antenna current transmission line model frequency-selective surface analytical approximation low-temperature soldering 3D IC Bi aggregation Sn-Bi solder integrated circuit interconnects aging reliability electromigration physics-based modeling average power handling capability (APHC) slow-wave transmission line (SWTL) thermal resistance average heat-spreading width temperature-dependent resistivity broadside structure far-end crosstalk impedance interposer channel silicon interposer vertical tabbed via on-chip interconnect carbon nanotube through-silicon-via (TSV) Cu-CNT composite Cu–Sn bonding Au–Au bonding graphene high-temperature pressure sensor substrate integrated waveguide (SIW) spoof surface plasmon polaritons (SSPPs) integrated passive device through-dielectric capacitor (TDC) electromagnetic bandgap (EBG) interposers low-loss substrates noise suppression structures packages power delivery network (PDN) power/ground noise Pt–Pt interconnection high-temperature resistant packaging metallic bonding Au wire bonding high-temperature annealing focused ion beam (FIB) morphology analysis wettability hot-melt glass flow time coverage thickness SiO2 and Au substrate MEMS sensor reliability evaluation vacuum degradation mathematical model parylene blood oxygen sensing array wearable device on-chip spiral inductor circuit model kinetic inductance quantum resistance frequency selective rasorber (FSR) spoof surface plasmon polaritons (SSPP) frequency selective surface (FSS) broadband dual active bridge deadbeat controller load feedforward n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology |
| url | ONIX_20230405_9783036567334_84 |