Advanced Interconnect and Packaging

Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Format:	Online
Sprache:	Englisch
Veröffentlicht:	MDPI - Multidisciplinary Digital Publishing Institute 2023
Schlagworte:	antenna current transmission line model frequency-selective surface analytical approximation low-temperature soldering 3D IC Bi aggregation Sn-Bi solder integrated circuit interconnects aging reliability electromigration physics-based modeling average power handling capability (APHC) slow-wave transmission line (SWTL) thermal resistance average heat-spreading width temperature-dependent resistivity broadside structure far-end crosstalk impedance interposer channel silicon interposer vertical tabbed via on-chip interconnect carbon nanotube through-silicon-via (TSV) Cu-CNT composite Cu–Sn bonding Au–Au bonding graphene high-temperature pressure sensor substrate integrated waveguide (SIW) spoof surface plasmon polaritons (SSPPs) integrated passive device through-dielectric capacitor (TDC) electromagnetic bandgap (EBG) interposers low-loss substrates noise suppression structures packages power delivery network (PDN) power/ground noise Pt–Pt interconnection high-temperature resistant packaging metallic bonding Au wire bonding high-temperature annealing focused ion beam (FIB) morphology analysis wettability hot-melt glass flow time coverage thickness SiO2 and Au substrate MEMS sensor reliability evaluation vacuum degradation mathematical model parylene blood oxygen sensing array wearable device on-chip spiral inductor circuit model kinetic inductance quantum resistance frequency selective rasorber (FSR) spoof surface plasmon polaritons (SSPP) frequency selective surface (FSS) broadband dual active bridge deadbeat controller load feedforward n/a thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology
Online-Zugang:	ONIX_20230405_9783036567334_84
Tags:	Tag hinzufügen Keine Tags, Fügen Sie das erste Tag hinzu!

Schreiben Sie den ersten Kommentar!

Advanced Interconnect and Packaging

Ähnliche Einträge