Advanced Interconnect and Packaging
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...
Guardat en:
| Format: | Online |
|---|---|
| Idioma: | anglès |
| Publicat: |
MDPI - Multidisciplinary Digital Publishing Institute
2023
|
| Matèries: | |
| Accés en línia: | ONIX_20230405_9783036567334_84 |
| Etiquetes: |
Sense etiquetes, Sigues el primer a etiquetar aquest registre!
|
Ítems similars: Advanced Interconnect and Packaging
- Advanced Interconnect and Packaging
- MEMS Packaging Technologies and 3D Integration
- 2D Nanomaterials Processing and Integration in Miniaturized Devices
- Catalysis by Precious Metals, Past and Future
- Advances in Hard-to-Cut Materials: Manufacturing, Properties, Process Mechanics and Evaluation of Surface Integrity
- Obtaining and Characterization of New Materials